Plating method and recording medium
US-11519074-B2 · Dec 6, 2022 · US
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Mizutani Nobutaka patents
Mizutani Nobutaka is listed as an inventor on 42 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mizutani Nobutaka |
| Total patents | 42 |
| First publication | Jan 29, 2015 |
| Latest publication | Dec 6, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Forming method of hard mask
US-11004684-B2 · May 11, 2021 · US
Plating method, plating apparatus and recording medium
US-2021115565-A1 · Apr 22, 2021 · US
Plating method, plating system, and recording medium
US-2021108316-A1 · Apr 15, 2021 · US
Plating method and recording medium
US-2020325581-A1 · Oct 15, 2020 · US
Metal wiring layer forming method, metal wiring layer forming apparatus and recording medium
US-10755973-B2 · Aug 25, 2020 · US
Plating apparatus, plating method, and recording medium
US-10731256-B2 · Aug 4, 2020 · US
Metal wiring layer forming method, metal wiring layer forming apparatus and recording medium
US-2019229016-A1 · Jul 25, 2019 · US
Forming method of hard mask
US-2019157083-A1 · May 23, 2019 · US
Plating method and recording medium
US-10224208-B2 · Mar 5, 2019 · US
Recent patents
Latest publications not already listed above.
Forming method of hard mask, forming apparatus of hard mask and recording medium
US-10224202-B2 · Mar 5, 2019 · US
Plating method, plated component, and plating system
US-10179950-B2 · Jan 15, 2019 · US
Plating method, plating apparatus, and storage medium
US-10138556-B2 · Nov 27, 2018 · US
Plating method, plating system and storage medium
US-10030308-B2 · Jul 24, 2018 · US
Catalyst layer forming method, catalyst layer forming system and recording medium
US-9966306-B2 · May 8, 2018 · US
Method for manufacturing wiring structure, copper displacement plating solution, and wiring structure
US-9888585-B2 · Feb 6, 2018 · US
Plating method, plating system and storage medium
US-9837308-B2 · Dec 5, 2017 · US
Plating apparatus, plating method, and recording medium
US-2017292192-A1 · Oct 12, 2017 · US
Forming method of hard mask, forming apparatus of hard mask and recording medium
US-2017287713-A1 · Oct 5, 2017 · US
Plating method, plating apparatus and storage medium
US-9725810-B2 · Aug 8, 2017 · US
Plating method, recording medium and plating system
US-9711363-B2 · Jul 18, 2017 · US
Pre-treatment method for plating and storage medium
US-9653350-B2 · May 16, 2017 · US
Pre-treatment method of plating, storage medium, and plating system
US-9650717-B2 · May 16, 2017 · US
Metal wiring layer forming method, metal wiring layer forming apparatus, and recording medium
US-9653354-B2 · May 16, 2017 · US
Plating apparatus, plating method and recording medium
US-2017121822-A1 · May 4, 2017 · US
Substrate processing apparatus, substrate processing method and recording medium
US-2017084480-A1 · Mar 23, 2017 · US
Plating apparatus, plating method, and storage medium
US-9552994-B2 · Jan 24, 2017 · US
Plating method, plated component, and plating system
US-2016372367-A1 · Dec 22, 2016 · US
Plating method and recording medium
US-2016336179-A1 · Nov 17, 2016 · US
Plating method, recording medium and plating system
US-2016307759-A1 · Oct 20, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tokyo Electron Ltd | 42 |
| Mizutani Nobutaka | 1 |
| Tanaka Takashi | 1 |
| Iwashita Mitsuaki | 1 |
| A School Corporation Kansai Univ | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/46 | 27 |
| C23C18/1619 | 23 |
| H10W20/033 | 20 |
| H10W20/044 | 18 |
| C23C18/1893 | 18 |