Via bottom structure and methods of forming
US-2017077037-A1 · Mar 16, 2017 · US
Plating method, plated component, and plating system
US2016372367A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016372367-A1 |
| Application number | US-201615184215-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 16, 2016 |
| Priority date | Jun 19, 2015 |
| Publication date | Dec 22, 2016 |
| Grant date | — |
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- Title
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Abstract
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Reliability of a plating process and reliability of a component manufactured through the plating process can be improved by suppressing peeling between plating layers formed by electroless plating. In a plating method, a plated component manufactured by the plating method, and a plating system 1 configured to manufacture the plated component by the plating method, a second electroless plating layer 39, which is made of a copper alloy and formed by the electroless plating, is formed on a surface of a first electroless plating layer 38 formed by the electroless plating. The first electroless plating layer 38 is a barrier layer configured to suppress diffusion of copper and is made of cobalt or a cobalt alloy. The second electroless plating layer 39 is a seed layer for forming an electrolytic plating layer of copper on a surface thereof and is made of an alloy of copper and nickel.
First claim
Opening claim text (preview).
We claim: 1 . A plating method, comprising: forming, by electroless plating, a second electroless plating layer made of a copper alloy on a surface of a first electroless plating layer which is formed by electroless plating. 2 . The plating method of claim 1 , wherein the first electroless plating layer is a barrier layer configured to suppress diffusion of copper. 3 . The plating method of claim 1 , wherein the first electroless plating layer is made of cobalt or a cobalt alloy. 4 . The plating method of claim 1 , wherein the second electroless plating layer is made of an alloy of copper and nickel. 5 . The plating method of claim 1 , wherein the second electroless plating layer is a seed layer for forming an electrolytic plating layer of copper on a surface thereof. 6 . A plated component, comprising: a first electroless plating layer formed by electroless plating; and a second electroless plating layer made of a copper alloy and formed on a surface of the first electroless plating layer by electroless plating. 7 . The plated component of claim 6 , wherein the first electroless plating layer is a barrier layer configured to suppress diffusion of copper. 8 . The plated component of claim 6 , wherein the first electroless plating layer is made of cobalt or a cobalt alloy. 9 . The plated component of claim 6 , wherein the second electroless plating layer is made of an alloy of copper and nickel. 10 . The plated component of claim 6 , wherein the second electroless plating layer is a seed layer for forming an electrolytic plating layer of copper on a surface thereof. 11 . A plating system, comprising: a first electroless plating layer forming apparatus configured to form a first electroless plating layer on a surface by electroless plating; and a second electroless plating layer forming apparatus configured to form a second electroless plating layer, which is made of a copper alloy, on a surface of the first electroless plating layer by electroless plating.
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Classifications
comprising use of blind vias during the manufacture · CPC title
characterised by the filling method or the material of the conductive fill · CPC title
using a liquid · CPC title
comprising multiple stacked seed or nucleation layers · CPC title
in openings in dielectrics · CPC title
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Frequently asked questions
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- What does patent US2016372367A1 cover?
- Reliability of a plating process and reliability of a component manufactured through the plating process can be improved by suppressing peeling between plating layers formed by electroless plating. In a plating method, a plated component manufactured by the plating method, and a plating system 1 configured to manufacture the plated component by the plating method, a second electroless plating…
- Who is the assignee on this patent?
- Tokyo Electron Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01L21/76874. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Dec 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).