Plating method, plating system and storage medium

Patent metadata

Field	Value
Publication number	US-9837308-B2
Application number	US-201314384861-A
Country	US
Kind code	B2
Filing date	Feb 22, 2013
Priority date	Mar 27, 2012
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

A plating method can improve adhesivity with a substrate. The plating method of performing a plating process on the substrate includes forming a vacuum-deposited layer 2 A on the substrate 2 by performing a vacuum deposition process on the substrate 2 ; forming an adhesion layer 21 and a catalyst adsorption layer 22 on the vacuum-deposited layer 2 A of the substrate 2 ; and forming a plating layer stacked body 23 having a first plating layer 23 a and a second plating layer 23 b which function as a barrier film on the catalyst adsorption layer 22 of the substrate 2 . By forming the vacuum-deposited layer 2 A, a surface of the substrate 2 can be smoothened, so that the vacuum-deposited layer 2 A serving as an underlying layer can improve the adhesivity.

First claim

We claim:

1. A plating method of performing a plating process on a substrate, the plating method comprising:
preparing the substrate on which a plating layer has not been formed having a recess;
forming a vacuum-deposited layer only on an outer surface of the substrate at an outside of the recess and an upper portion of an inner surface of the recess, or only on the outer surface of the substrate at the outside of the recess by performing a vacuum deposition process on the substrate;
forming an adhesion layer on the vacuum-deposited layer and on a surface of the substrate at an inside of the recess by adsorbing a coupling agent onto the vacuum-deposited layer and the surface of the substrate at the inside of the recess;
forming a catalyst adsorption layer on the adhesion layer by adsorbing a catalyst onto the adhesion layer; and
forming a plating layer on the catalyst adsorption layer by an electroless plating method with a plating liquid,
wherein the plating layer is formed only on the surface of the catalyst adsorption layer such that the inside of the recess is not filled up with the plating layer.

2. The plating method of claim 1 ,
wherein the plating layer functions as a Cu diffusion barrier film.

3. The plating method of claim 1 ,
wherein the plating layer functions as a seed film for an electrolytic Cu plating layer.

4. The plating method of claim 1 ,
wherein the vacuum-deposited layer is formed through a PVD process.

5. The plating method of claim 1 ,
wherein the vacuum-deposited layer is formed through a CVD process.

6. A non-transitory computer-readable storage medium having stored thereon computer-executable instructions that, in response to execution, cause a plating system to perform a plating method,
wherein the plating method comprises:
preparing a substrate on which a plating layer has not been formed having a recess;
forming a vacuum-deposited layer only on an outer surface of the substrate at an outside of the recess and an upper portion of an inner surface of the recess, or only on the outer surface of the substrate at the outside of the recess by performing a vacuum deposition process on the substrate;
forming an adhesion layer on the vacuum-deposited layer and on a surface of the substrate at an inside of the recess by adsorbing a coupling agent onto the vacuum-deposited layer and the surface of the substrate at the inside of the recess;
forming a catalyst adsorption layer on the adhesion layer by adsorbing a catalyst onto the adhesion layer; and
forming a plating layer on the catalyst adsorption layer by an electroless plating method with a plating liquid,
wherein the plating layer is formed only on the surface of the catalyst adsorption layer such that the inside of the recess is not filled up with the plating layer.

Assignees

• Tokyo Electron Ltd

Inventors

• Mizutani Nobutaka
• Tanaka Takashi
• Inatomi Yuichiro
• Saito Yusuke
• Iwashita Mitsuaki

Classifications

• H10P14/46 Primary

  using a liquid · CPC title

• H10W20/044

  for electroless plating · CPC title

• H10W20/043

  for electroplating · CPC title

• H10W20/033

  in openings in dielectrics · CPC title

• H10W20/032

  of conductive barrier, adhesion or liner layers · CPC title