Plating method, plating apparatus and recording medium

Patent metadata

Field	Value
Publication number	US-2021115565-A1
Application number	US-201816496064-A
Country	US
Kind code	A1
Filing date	Mar 22, 2018
Priority date	Mar 23, 2017
Publication date	Apr 22, 2021
Grant date	—

Abstract

A plating method includes preparing a substrate having a surface including an adhesive material portion made of a material to which a catalyst easily adheres and a non-adhesive material portion to which the catalyst is difficult to attach; imparting the catalyst to the substrate by supplying a catalyst solution onto the substrate; removing, by supplying a catalyst removing liquid containing a reducing agent onto the substrate, the catalyst from the non-adhesive material portion while allowing the catalyst to be left on a surface of the adhesive material portion; and forming a plating layer selectively on the adhesive material portion by supplying a plating liquid onto the substrate.

First claim

We claim:

1 . A plating method, comprising:
preparing a substrate having a surface including an adhesive material portion made of a material to which a catalyst easily adheres and a non-adhesive material portion to which the catalyst is difficult to attach; imparting the catalyst to the substrate by supplying a catalyst solution onto the substrate; removing, by supplying a catalyst removing liquid containing a reducing agent onto the substrate, the catalyst from the non-adhesive material portion while allowing the catalyst to be left on a surface of the adhesive material portion; and forming a plating layer selectively on the adhesive material portion by supplying a plating liquid onto the substrate.

2 . The plating method of claim 1 ,
wherein the plating liquid is an electroless plating liquid containing a reducing agent, and the catalyst removing liquid contains the same reducing agent as the reducing agent contained in the electroless plating liquid.

3 . The plating method of claim 2 ,
wherein the catalyst removing liquid is prepared by diluting the reducing agent contained in the electroless plating liquid with pure water.

4 . The plating method of claim 2 ,
wherein the reducing agent contained in the electroless plating liquid is dimethylamineborane (DMAB).

5 . The plating method of claim 2 ,
wherein the forming of the plating layer is performed without performing a rinsing processing of removing the catalyst removing liquid from the substrate after performing the removing of the catalyst.

6 . The plating method of claim 1 ,
wherein the catalyst removing liquid is alkaline.

7 . The plating method of claim 1 ,
wherein the non-adhesive material portion is made of silicon oxide as a main component, and the adhesive material portion is made of silicon nitride as a main component.

8 . The plating method of claim 1 ,
wherein the substrate includes a base member made of the adhesive material portion and a core member which is protruded from the base member and is made of the non-adhesive material portion.

9 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a plating apparatus to perform a plating method as claimed in claim 1 .

10 . A plating apparatus, comprising:
a substrate holder configured to hold a substrate; a catalyst imparting device configured to impart a catalyst solution to the substrate; a catalyst removing liquid supply configured to supply a catalyst removing liquid onto the substrate; a plating liquid supply configured to supply a plating liquid onto the substrate; and a controller configured to control the plating apparatus to perform a plating method as claimed in claim 1 .

Assignees

• Tokyo Electron Ltd

Inventors

• Inatomi Yuichiro
• Mizutani Nobutaka

Classifications

• H10P50/283

  by chemical means · CPC title

• H10P50/73 Primary

  using masks for insulating materials · CPC title

• H10P76/405

  characterised by their composition, e.g. multilayer masks · CPC title

• C23C18/1632

  Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells · CPC title

• C23C18/1605

  by masking · CPC title