Plating apparatus, plating method, and recording medium

Patent metadata

Field	Value
Publication number	US-2017292192-A1
Application number	US-201715479429-A
Country	US
Kind code	A1
Filing date	Apr 5, 2017
Priority date	Apr 7, 2016
Publication date	Oct 12, 2017
Grant date	—

Abstract

A plating apparatus, a plating method and a recording medium can allow a temperature of a wafer to be uniform within a surface thereof. A plating apparatus 1 includes a substrate holding unit 52 configured to hold a substrate W; a plating liquid supply unit 53 configured to supply a plating liquid M 1 to the substrate W; and a solvent supply unit 55 a configured to supply a solvent N 1 having a different temperature from a temperature of the plating liquid M 1 to the substrate W. The solvent N 1 is supplied to a preset position on the substrate W from the solvent supply unit 55 a after the plating liquid M 1 is supplied to the substrate W from the plating liquid supply unit 53.

First claim

We claim:

1 . A plating apparatus, comprising:
a substrate holding unit configured to hold a substrate; a plating liquid supply unit configured to supply a plating liquid to the substrate; and a solvent supply unit configured to supply a solvent constituting the plating liquid and having a different temperature from a temperature of the plating liquid to the substrate, wherein the solvent is supplied to a preset position on the substrate from the solvent supply unit after the plating liquid is supplied to the substrate from the plating liquid supply unit.

2 . The plating apparatus of claim 1 ,
wherein the temperature of the solvent is higher than the temperature of the plating liquid.

3 . The plating apparatus of claim 1 ,
wherein the plating liquid supply unit comprises a plating liquid nozzle configured to supply the plating liquid, and the solvent supply unit comprises a solvent nozzle configured to supply the solvent.

4 . The plating apparatus of claim 3 ,
wherein the plating liquid nozzle and the solvent nozzle are configured to be moved above the substrate as one body.

5 . The plating apparatus of claim 4 ,
wherein the solvent nozzle is disposed to surround the plating liquid nozzle.

6 . The plating apparatus of claim 3 ,
wherein the plating liquid nozzle and the solvent nozzle are inclined in different directions when viewed from a side thereof.

7 . The plating apparatus of claim 3 ,
wherein the plating liquid nozzle and the solvent nozzle are configured to be separately moved above the substrate.

8 . The plating apparatus of claim 3 ,
wherein the solvent nozzle is located at a fixed position above the substrate.

9 . The plating apparatus of claim 3 ,
wherein at least one of the plating liquid nozzle and the solvent nozzle is provided in two or more.

10 . A plating method, comprising:
a substrate holding process of holding a substrate; a process of supplying a plating liquid to the substrate from a plating liquid supply unit; and a liquid supplying process of supplying a solvent having a temperature different from a temperature of the plating liquid to a preset position on the substrate from a solvent supply unit.

11 . The plating method of claim 10 ,
wherein the temperature of the solvent is higher than the temperature of the plating liquid.

12 . The plating method of claim 10 ,
wherein the plating liquid and the solvent are supplied together for at least a preset time period in the liquid supplying process.

13 . The plating method of claim 10 ,
wherein the plating liquid supply unit comprises a plating liquid nozzle configured to supply the plating liquid, the liquid supplying process comprises: a first supplying process of moving the plating liquid nozzle from a central portion side of the substrate toward a peripheral portion side of the substrate in a state that the plating liquid supply unit supplies the plating liquid and the supply of the solvent from the solvent supply unit is stopped; and a second supplying process of continuously supplying the plating liquid and starting the supply of the solvent from the solvent supply unit while the plating liquid nozzle is being moved from the central portion side of the substrate toward the peripheral portion side of the substrate.

14 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a plating apparatus to perform a plating method as claimed in claim 10 .

Assignees

• Tokyo Electron Ltd

Inventors

• IWAI Kazutoshi
• Mizutani Nobutaka
• Inatomi Yuichiro
• Tanaka Takashi

Classifications

• C23C18/1619

  Apparatus for electroless plating · CPC title

• C23C18/1676

  Heating of the solution · CPC title

• C23C18/163

  Supporting devices for articles to be coated · CPC title

• C23C18/1675

  Process conditions · CPC title

• C23C18/1632

  Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells · CPC title