Plating method and recording medium

Patent metadata

Field	Value
Publication number	US-2020325581-A1
Application number	US-202016914652-A
Country	US
Kind code	A1
Filing date	Jun 29, 2020
Priority date	Apr 7, 2016
Publication date	Oct 15, 2020
Grant date	—

Abstract

A plating apparatus, a plating method and a recording medium can allow a temperature of a wafer to be uniform within a surface thereof. A plating apparatus 1 includes a substrate holding unit 52 configured to hold a substrate W; a plating liquid supply unit 53 configured to supply a plating liquid M1 to the substrate W; and a solvent supply unit 55a configured to supply a solvent N1 having a different temperature from a temperature of the plating liquid M1 to the substrate W. The solvent N1 is supplied to a preset position on the substrate W from the solvent supply unit 55a after the plating liquid M1 is supplied to the substrate W from the plating liquid supply unit 53.

First claim

We claim:

1 . A plating method, comprising:
a substrate holding process of holding a substrate; a process of supplying a plating liquid to the substrate from a plating liquid supply unit; and a liquid supplying process of supplying a solvent having a temperature different from a temperature of the plating liquid to a preset position on the substrate from a solvent supply unit, wherein the plating liquid supply unit comprises a plating liquid nozzle configured to supply the plating liquid, the liquid supplying process comprises: a first supplying process of moving the plating liquid nozzle from a central portion side of the substrate toward a peripheral portion side of the substrate in a state that the plating liquid supply unit supplies the plating liquid and the supply of the solvent from the solvent supply unit is stopped; and a second supplying process of continuously supplying the plating liquid and starting the supply of the solvent from the solvent supply unit while the plating liquid nozzle is being moved from the central portion side of the substrate toward the peripheral portion side of the substrate.

2 . The plating method of claim 1 ,
wherein the temperature of the solvent is higher than the temperature of the plating liquid.

3 . The plating method of claim 1 ,
wherein the plating liquid and the solvent are supplied together for at least a preset time period in the liquid supplying process.

4 . A non-transitory computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a plating apparatus to perform a plating method as claimed in claim 1 .

Assignees

• Tokyo Electron Ltd

Inventors

• IWAI Kazutoshi
• Mizutani Nobutaka
• Inatomi Yuichiro
• Tanaka Takashi

Classifications

• H10W72/01935

  by plating, e.g. electroless plating or electroplating · CPC title

• C23C18/1619

  Apparatus for electroless plating · CPC title

• C23C18/34 Primary

  using reducing agents · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title