Plating apparatus, plating method and storage medium
US-2015232994-A1 · Aug 20, 2015 · US
Plating method and recording medium
US11519074B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11519074-B2 |
| Application number | US-202016914652-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 29, 2020 |
| Priority date | Apr 7, 2016 |
| Publication date | Dec 6, 2022 |
| Grant date | Dec 6, 2022 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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- CPC / IPC classifications
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Abstract
Official abstract text for this publication.
A plating apparatus, a plating method and a recording medium can allow a temperature of a wafer to be uniform within a surface thereof. A plating apparatus 1 includes a substrate holding unit 52 configured to hold a substrate W; a plating liquid supply unit 53 configured to supply a plating liquid M1 to the substrate W; and a solvent supply unit 55a configured to supply a solvent N1 having a different temperature from a temperature of the plating liquid M1 to the substrate W. The solvent N1 is supplied to a preset position on the substrate W from the solvent supply unit 55a after the plating liquid M1 is supplied to the substrate W from the plating liquid supply unit 53.
First claim
Opening claim text (preview).
We claim: 1. A plating method, comprising: holding a substrate by a substrate holding unit; supplying a plating liquid to the substrate from a plating liquid supply unit; and supplying a solvent that does not contain a metal component constituting the plating liquid and having a temperature different from a temperature of the plating liquid to a preset position on the substrate from a solvent supply unit, wherein the plating liquid supply unit comprises a plating liquid nozzle configured to supply the plating liquid, the supplying of the solvent comprises: moving the plating liquid nozzle from a central portion side of the substrate toward a peripheral portion side of the substrate in a state that the plating liquid supply unit supplies the plating liquid and the supply of the solvent from the solvent supply unit is stopped; and continuously supplying the plating liquid and starting the supply of the solvent from the solvent supply unit while the plating liquid nozzle is being moved from the central portion side of the substrate toward the peripheral portion side of the substrate. 2. The plating method of claim 1 , wherein the temperature of the solvent is higher than the temperature of the plating liquid. 3. The plating method of claim 1 , wherein the plating liquid and the solvent are supplied together for at least a preset time period in the supplying of the solvent.
Assignees
Inventors
Classifications
Heating of the substrate · CPC title
Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells · CPC title
Heating of the solution · CPC title
Apparatus for electroless plating · CPC title
- C23C18/34Primary
using reducing agents · CPC title
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Frequently asked questions
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- What does patent US11519074B2 cover?
- A plating apparatus, a plating method and a recording medium can allow a temperature of a wafer to be uniform within a surface thereof. A plating apparatus 1 includes a substrate holding unit 52 configured to hold a substrate W; a plating liquid supply unit 53 configured to supply a plating liquid M1 to the substrate W; and a solvent supply unit 55a configured to supply a solvent N1 having a di…
- Who is the assignee on this patent?
- Tokyo Electron Ltd
- What technology area does this patent fall under?
- Primary CPC classification C23C18/34. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Dec 06 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).