Pre-treatment method of plating, storage medium, and plating system

Patent metadata

Field	Value
Publication number	US-9650717-B2
Application number	US-201514633319-A
Country	US
Kind code	B2
Filing date	Feb 27, 2015
Priority date	Feb 28, 2014
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

A pre-treatment method of plating and a plating system can perform a uniform plating process in which sufficient adhesivity on a surface of a substrate is obtained. The pre-treatment method of plating includes a coupling layer forming process of forming a titanium-based coupling layer 21 b on the surface of the substrate with a titanium coupling agent; and a coupling layer modification process of modifying a surface of the titanium-based coupling layer 21 b with a modifying liquid after the coupling layer forming process.

First claim

We claim:

1. A pre-treatment method of plating, comprising:
a preparing process of preparing a substrate having a recess;
a coupling layer forming process of forming a titanium-based coupling layer on a surface of the substrate which is outside of the recess with a titanium coupling agent; and
a coupling layer modification process of modifying a surface of the titanium-based coupling layer by cleaning the surface of the titanium-based coupling layer with a modifying liquid,
wherein the coupling layer modification process is performed by a spin-on process with a spinner, and a rotation speed in the spin-on process is controlled to suppress the modifying liquid from entering the recess.

2. The pre-treatment method of plating of claim 1 ,
wherein a fluorine-based liquid or an alkaline liquid is used as the modifying liquid.

3. The pre-treatment method of plating of claim 1 ,
wherein a first baking process of baking the substrate at a first temperature is performed between the coupling layer forming process and the coupling layer modification process.

4. The pre-treatment method of plating of claim 1 ,
wherein a second baking process of baking the substrate at a second temperature is performed after the coupling layer modification process.

5. The pre-treatment method of plating of claim 1 , further comprising:
a coupling process of coupling a metal catalytic particle to the surface of the titanium-based coupling layer after the coupling layer modification process.

Assignees

• Tokyo Electron Ltd

Inventors

• IWAI Kazutoshi
• Mizutani Nobutaka
• Iwashita Mitsuaki

Classifications

• C23C18/1844

  with use of organic or inorganic compounds other than metals, first · CPC title

• C23C18/1893

  with use of organic or inorganic compounds other than metals, first · CPC title

• C23C18/1817

  Heat · CPC title

• C23C18/1651

  Two or more layers only obtained by electroless plating · CPC title

• C23C18/1675

  Process conditions · CPC title