Plating apparatus, plating method and recording medium

Patent metadata

Field	Value
Publication number	US-2017121822-A1
Application number	US-201615333303-A
Country	US
Kind code	A1
Filing date	Oct 25, 2016
Priority date	Oct 28, 2015
Publication date	May 4, 2017
Grant date	—

Abstract

A plating apparatus can suppress a time period during which a plating liquid is used in a plating from being reduced. In the plating apparatus 1, after a plating liquid supply unit 53 supplies, to a substrate W1, a plating liquid which exerts a preset plating performance within a preset concentration range and which has an initial temperature adjusted to be lower than a preset plating temperature; and an initial concentration adjusted such that a concentration of the plating liquid at a moment when a temperature of the plating liquid has reached the preset plating temperature is equal to or higher than a lower limit of the preset concentration range and equal to or below a median value of the preset concentration range, a plating liquid heating unit 63 heats the plating liquid supplied to the substrate W1 to the preset plating temperature.

First claim

We claim:

1 . A plating apparatus having a plating device configured to perform a plating on a substrate at a preset plating temperature; and a controller configured to control an operation of the plating device,
wherein the plating device comprises: a plating liquid supply unit configured to supply, to the substrate, a plating liquid which allowed to exert a preset plating performance within a preset concentration range; and a plating liquid heating unit configured to heat the plating liquid supplied to the substrate to the preset plating temperature, wherein the plating liquid supplied to the substrate from the plating liquid supply unit has an initial temperature adjusted to be lower than the preset plating temperature, and an initial concentration adjusted such that a concentration of the plating liquid at a moment when a temperature of the plating liquid has reached the preset plating temperature while being heated by the plating liquid heating unit is equal to or higher than a lower limit of the preset concentration range and equal to or below a median value of the preset concentration range, and the controller controls the plating liquid supply unit and the plating liquid heating unit to perform, by supplying a preset amount of the plating liquid to the substrate a single time and heating the supplied plating liquid to the preset plating temperature, the plating with the plating liquid heated to the preset plating temperature.

2 . The plating apparatus of claim 1 ,
wherein the initial concentration is adjusted such that the concentration of the plating liquid at the moment when the temperature of the plating liquid has reached the preset plating temperature is close to the lower limit of the preset concentration range.

3 . The plating apparatus of claim 1 ,
wherein the initial concentration is adjusted to be lower than the lower limit of the preset concentration range.

4 . The plating apparatus of claim 1 ,
wherein the plating device is equipped with a top plate disposed above the substrate, and when the plating liquid supplied to the substrate is heated by the plating liquid heating unit, a space in which vapor generated from the plating liquid supplied to the substrate stays is formed between the substrate and the top plate.

5 . A plating method of performing a plating on a substrate at a preset plating temperature, the plating method comprising:
a plating liquid supplying process of supplying, to the substrate, a plating liquid which exerts a preset plating performance within a preset concentration range and which has an initial temperature adjusted to be lower than the preset plating temperature; and an initial concentration adjusted such that a concentration of the plating liquid at a moment when a temperature of the plating liquid has reached the preset plating temperature is equal to or higher than a lower limit of the preset concentration range and equal to or below a median value of the preset concentration range; and a plating liquid heating process of heating the plating liquid supplied to the substrate to the preset plating temperature, wherein a preset amount of the plating liquid is supplied to the substrate a single time in the plating liquid supplying process, and in the plating liquid heating process, the plating liquid supplied in the plating liquid supplying process is heated to the preset plating temperature, and the plating is performed with the plating liquid heated to the preset plating temperature.

6 . The plating method of claim 5 ,
wherein the initial concentration is adjusted such that the concentration of the plating liquid at the moment when the temperature of the plating liquid has reached the preset plating temperature is close to the lower limit of the preset concentration range.

7 . The plating method of claim 5 ,
wherein the initial concentration is adjusted to be lower than the lower limit of the preset concentration range.

8 . The plating method of claim 5 ,
wherein the plating liquid heating process is performed in a state where a space in which vapor generated from the plating liquid supplied to the substrate stays is formed between the substrate and a top plate disposed above the substrate.

9 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a plating apparatus to perform a plating method as claimed in claim 5 .

Assignees

• Tokyo Electron Ltd

Inventors

• Mizutani Nobutaka
• Iwashita Mitsuaki
• Inatomi Yuichiro

Classifications

• C23C18/1619 Primary

  Apparatus for electroless plating · CPC title

• C23C18/31

  Coating with metals · CPC title

• C23C18/1675

  Process conditions · CPC title

• C23C18/168

  Control of temperature, e.g. temperature of bath, substrate · CPC title

• C23C18/1676 Primary

  Heating of the solution · CPC title