Forming method of hard mask, forming apparatus of hard mask and recording medium

US10224202B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10224202-B2
Application numberUS-201715473810-A
CountryUS
Kind codeB2
Filing dateMar 30, 2017
Priority dateMar 31, 2016
Publication dateMar 5, 2019
Grant dateMar 5, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A catalyst is imparted selectively to a plateable material portion 32 by performing a catalyst imparting processing on a substrate W having a non-plateable material portion 31 and the plateable material portion 32 formed on a surface thereof. Then, a hard mask layer 35 is formed selectively on the plateable material portion 32 by performing a plating processing on the substrate W. The non-plateable material portion 31 is made of SiO2 as a main component, and the plateable material portion 32 is made of a material including, as a main component, a material containing at least one of a OCHx group and a NHx group, a metal material containing Si as a main component, a material containing carbon as a main component or a catalyst metal material.

First claim

Opening claim text (preview).

We claim: 1. A forming method of a hard mask, comprising: preparing a substrate having a member made of a non-plateable material and a member made of a plateable material; supplying a catalyst selectively to an exposed surface of the member made of the plateable material by performing a catalyst supplying processing on the substrate; forming a hard mask layer selectively on the exposed surface of the member made of the plateable material by performing a plating processing on the substrate; and removing the member made of the non-plateable material from the substrate and exposing the member made of the plateable material at a portion which is not covered with the hard mask layer, wherein the non-plateable material comprises SiO 2 as a main component, and the plateable material comprises a material including, as a main component, a material containing at least one of a OCH x group and a NH x group, a material containing Si as a main component, a catalyst metal material, or a material containing carbon as a main component. 2. The forming method of the hard mask of claim 1 , wherein the plateable material includes, as the main component, a material containing a Si—OCH x group or a Si—NH x group. 3. The forming method of the hard mask of claim 1 , wherein the hard mask layer is made of a material including, as a main component, Co or a Co alloy containing B or P, or a Ni-based material. 4. The forming method of the hard mask of claim 1 , wherein the catalyst contains an iron group element, a platinum metal element, Cu, Ag or Au. 5. The forming method of the hard mask of claim 1 , wherein the member made of the plateable material is a base member and the member made of the non-plateable material is a core member which is protruded on the base member. 6. A non-transitory computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a forming apparatus of a hard mask to perform a forming method of a hard mask as claimed in claim 1 .

Assignees

Inventors

Classifications

  • characterised by their composition, e.g. multilayer masks or materials · CPC title

  • using masks for insulating materials · CPC title

  • using masks for conductive or resistive materials · CPC title

  • H10P76/405Primary

    characterised by their composition, e.g. multilayer masks · CPC title

  • using masks · CPC title

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Frequently asked questions

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What does patent US10224202B2 cover?
A catalyst is imparted selectively to a plateable material portion 32 by performing a catalyst imparting processing on a substrate W having a non-plateable material portion 31 and the plateable material portion 32 formed on a surface thereof. Then, a hard mask layer 35 is formed selectively on the plateable material portion 32 by performing a plating processing on the substrate W. The non-plate…
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification H10P76/405. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 05 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).