Substrate processing method and substrate processing apparatus
US-12506012-B2 · Dec 23, 2025 · US
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Kagawa Koji patents
Kagawa Koji is listed as an inventor on 34 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kagawa Koji |
| Total patents | 34 |
| First publication | Feb 9, 2017 |
| Latest publication | Dec 23, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Substrate processing method and substrate processing apparatus
US-2025132164-A1 · Apr 24, 2025 · US
Substrate processing device and etching liquid
US-12203021-B2 · Jan 21, 2025 · US
Substrate processing system and substrate processing method
US-2024307821-A1 · Sep 19, 2024 · US
Substrate processing method and substrate processing apparatus
US-2024222157-A1 · Jul 4, 2024 · US
Substrate processing method and substrate processing apparatus
US-12020943-B2 · Jun 25, 2024 · US
Substrate processing apparatus and substrate processing method
US-2024128307-A1 · Apr 18, 2024 · US
Substrate treatment method and substrate treatment device
US-11875991-B2 · Jan 16, 2024 · US
Substrate processing method and substrate processing apparatus
US-2023386855-A1 · Nov 30, 2023 · US
Substrate processing method, substrate processing apparatus and recording medium
US-11626294-B2 · Apr 11, 2023 · US
Recent patents
Latest publications not already listed above.
Substrate cleaning method
US-11551941-B2 · Jan 10, 2023 · US
Substrate processing apparatus, substrate processing method, and storage medium storing program for executing substrate processing method
US-11551931-B2 · Jan 10, 2023 · US
Substrate processing method and substrate processing apparatus
US-2022316059-A1 · Oct 6, 2022 · US
Substrate processing method and substrate processing apparatus
US-2022301880-A1 · Sep 22, 2022 · US
Substrate processing device and etching liquid
US-2022213382-A1 · Jul 7, 2022 · US
Substrate processing method, substrate processing device and etching liquid
US-11306249-B2 · Apr 19, 2022 · US
Substrate processing method and substrate processing device
US-2022068642-A1 · Mar 3, 2022 · US
Substrate processing method and substrate processing apparatus
US-2021305066-A1 · Sep 30, 2021 · US
Substrate treatment method and substrate treatment device
US-2021257209-A1 · Aug 19, 2021 · US
Substrate processing apparatus, substrate processing method, and storage medium storing program for executing substrate processing method
US-2021217620-A1 · Jul 15, 2021 · US
Substrate processing method and substrate processing apparatus
US-11049723-B2 · Jun 29, 2021 · US
Substrate processing method, substrate processing apparatus, and substrate processing system
US-10985026-B2 · Apr 20, 2021 · US
Substrate processing method, substrate processing device and etching liquid
US-2021032537-A1 · Feb 4, 2021 · US
Substrate cleaning method
US-2020303220-A1 · Sep 24, 2020 · US
Substrate processing method, substrate processing apparatus and recording medium
US-2020279752-A1 · Sep 3, 2020 · US
Substrate processing method and substrate processing apparatus
US-2020219730-A1 · Jul 9, 2020 · US
Substrate Processing Method, Substrate Processing Apparatus, and Substrate Processing System
US-2019348293-A1 · Nov 14, 2019 · US
Method and apparatus for substrate processing
US-10381233-B2 · Aug 13, 2019 · US
Substrate cleaning apparatus and substrate cleaning method
US-2018330971-A1 · Nov 15, 2018 · US
Substrate processing apparatus and substrate processing method
US-10121646-B2 · Nov 6, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tokyo Electron Ltd | 34 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0414 | 21 |
| H10P72/0406 | 20 |
| H10P72/0424 | 17 |
| H10P50/283 | 15 |
| H10P50/642 | 13 |