Substrate processing method and substrate processing apparatus

US2022301880A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2022301880-A1
Application numberUS-202217690709-A
CountryUS
Kind codeA1
Filing dateMar 9, 2022
Priority dateMar 17, 2021
Publication dateSep 22, 2022
Grant date

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

A substrate processing method includes: a preparing process of preparing a substrate in which a zirconium oxide film as a mask has been formed on a laminated film and dry-etched into a given shape; after the preparing process, a mask removing process of removing the zirconium oxide film by supplying a mask removing liquid containing sulfuric acid as a main component to the substrate; and after the mask removing process, a drying process of drying a surface of the substrate that is wet with a rinsing liquid.

First claim

Opening claim text (preview).

What is claimed is: 1 . A substrate processing method comprising: a preparing process of preparing a substrate in which a zirconium oxide film as a mask has been formed on a laminated film and dry-etched into a given shape; after the preparing process, a mask removing process of removing the zirconium oxide film by supplying a mask removing liquid containing sulfuric acid as a main component to the substrate; and after the mask removing process, a drying process of drying a surface of the substrate that is wet with a rinsing liquid. 2 . The substrate processing method of claim 1 , further comprising: after the mask removing process, a residue removing process of removing a residue caused by at least one of the zirconium oxide film and the mask removing solution by supplying an aqueous solution containing a fluoride compound to the substrate. 3 . The substrate processing method of claim 2 , further comprising: between the mask removing process and the residue removing process, another residue removing process of removing a residue caused by the mask removing liquid by supplying heated pure water to the substrate. 4 . The substrate processing method of claim 2 , wherein, in the drying process, on the surface of the substrate that is wet with the rinsing liquid, the rinsing liquid is replaced with a water-soluble alcohol, and then the surface of the substrate is dried. 5 . The substrate processing method of claim 2 , wherein, in the drying process, the surface of the substrate is dried using a processing fluid in a supercritical state. 6 . The substrate processing method of claim 2 , wherein the drying process includes: a first replacing process of replacing the rinsing liquid on the surface of the substrate that is wet with the rinsing liquid with an organic solvent; a water-repellent process of supplying a water-repellent agent to the surface of the substrate after the first replacing process; a second replacing process of replacing the water-repellent agent on the surface of the substrate with an organic solvent after the water-repellent process; and a shake-off process of shaking off the organic solvent located on the surface of the substrate after the second replacing process. 7 . The substrate processing method of claim 2 , wherein, in the mask removing process, the mask removing liquid is heated by reaction heat generated when the sulfuric acid and pure water are mixed. 8 . The substrate processing method of claim 2 , wherein, in the mask removing process, the mask removing liquid is heated by reaction heat generated when the sulfuric acid and steam are mixed. 9 . The substrate processing method of claim 1 , further comprising: after the mask removing process, a residue removing process of removing a residue caused by at least one of the zirconium oxide film and the mask removing solution by supplying an aqueous solution containing ammonia to the substrate. 10 . The substrate processing method of claim 9 , further comprising: between the mask removing process and the residue removing process, another residue removing process of removing a residue caused by the mask removing liquid by supplying heated pure water to the substrate. 11 . The substrate processing method of claim 1 , wherein, in the drying process, on the surface of the substrate that is wet with the rinsing liquid, the rinsing liquid is replaced with a water-soluble alcohol, and then the surface of the substrate is dried. 12 . The substrate processing method of claim 1 , wherein, in the drying process, the surface of the substrate is dried using a processing fluid in a supercritical state. 13 . The substrate processing method of claim 1 , wherein the drying process includes: a first replacing process of replacing the rinsing liquid on the surface of the substrate that is wet with the rinsing liquid with an organic solvent; a water-repellent process of supplying a water-repellent agent to the surface of the substrate after the first replacing process; a second replacing process of replacing the water-repellent agent on the surface of the substrate with an organic solvent after the water-repellent process; and a shake-off process of shaking off the organic solvent located on the surface of the substrate after the second replacing process. 14 . The substrate processing method of claim 1 , wherein, in the mask removing process, the mask removing liquid is heated by reaction heat generated when the sulfuric acid and pure water are mixed. 15 . The substrate processing method of claim 1 , wherein, in the mask removing process, the mask removing liquid is heated by reaction heat generated when the sulfuric acid and steam are mixed. 16 . A substrate processing apparatus comprising: a holder configured to hold and rotate a substrate; a liquid supplier configured to supply a processing liquid to the substrate held by the holder; and a controller configured to control the holder and the liquid supplier, wherein the controller is configured to a control to: supply a mask removing liquid containing sulfuric acid as a main component to the substrate in which a zirconium oxide film as a mask has been formed on a laminated film and dry-etched into a given shape, so that the zirconium oxide film is removed; and dry the surface of the substrate that is wet with a rinsing liquid after the zirconium oxide film is removed.

Assignees

Inventors

Classifications

  • using masks for insulating materials · CPC title

  • using masks for conductive or resistive materials · CPC title

  • the material containing zirconium, e.g. ZrO2 · CPC title

  • Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title

  • during, before or after processing of insulating materials · CPC title

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What does patent US2022301880A1 cover?
A substrate processing method includes: a preparing process of preparing a substrate in which a zirconium oxide film as a mask has been formed on a laminated film and dry-etched into a given shape; after the preparing process, a mask removing process of removing the zirconium oxide film by supplying a mask removing liquid containing sulfuric acid as a main component to the substrate; and after …
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification H10P50/283. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Sep 22 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).