Apparatuses and memory devices including air gaps between conductive lines
US-12593679-B2 · Mar 31, 2026 · US
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Hill Richard J patents
Hill Richard J is listed as an inventor on 161 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hill Richard J |
| Total patents | 161 |
| First publication | May 29, 2018 |
| Latest publication | Mar 31, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Merged cavities and buried etch stops for three-dimensional memory arrays
US-12575102-B2 · Mar 10, 2026 · US
Memory apparatus and methods including merged process for memory cell pillar and source structure
US-12568621-B2 · Mar 3, 2026 · US
Electronic devices comprising a stack structure, a source contact, and a dielectric material
US-12563787-B2 · Feb 24, 2026 · US
Electronic devices comprising adjoining oxide materials and related systems
US-12557289-B2 · Feb 17, 2026 · US
Methods used in forming a memory array comprising strings of memory cells including selectively etching sacrificial material in a memory-cell region selectively relative to insulating, insulator and/or insulative material(s) to form void spaces between conductive tiers
US-12557274-B2 · Feb 17, 2026 · US
Memory Circuitry Comprising Strings of Memory Cells and Method Used in Forming a Memory Array Comprising Strings of Memory Cells
US-2026040541-A1 · Feb 5, 2026 · US
Memory devices including charge trap memory cells and ferroelectric memory cells
US-2026040570-A1 · Feb 5, 2026 · US
Electronic structures comprising multiple, adjoining high-k dielectric materials and related electronic devices, systems, and methods
US-12543308-B2 · Feb 3, 2026 · US
Microelectronic devices with through-stack vias within shallow stadiums and outside of deep stadiums, and related methods
US-2026033310-A1 · Jan 29, 2026 · US
Recent patents
Latest publications not already listed above.
Multi-step etching in memory architectures
US-2026033302-A1 · Jan 29, 2026 · US
Techniques to form bridges between blocks of memory cells
US-2026020238-A1 · Jan 15, 2026 · US
Memory Arrays, and Methods of Forming Memory Arrays
US-2025393214-A1 · Dec 25, 2025 · US
Bonding structure and related fabrication for a memory system
US-2025379123-A1 · Dec 11, 2025 · US
Memory device including conductive contacts in treated tiers
US-2025372168-A1 · Dec 4, 2025 · US
Memory circuitry comprising strings of memory cells and method used in forming a memory array comprising strings of memory cells
US-12464713-B2 · Nov 4, 2025 · US
Microelectronic devices including pillars with upper portions having perimeters interrputed by elongate isolation structures
US-2025301648-A1 · Sep 25, 2025 · US
Memory arrays, and methods of forming memory arrays
US-12408341-B2 · Sep 2, 2025 · US
Electronic devices comprising multilevel bitlines, and related methods and systems
US-2025210511-A1 · Jun 26, 2025 · US
Microelectronic devices including pillars with partially-circular upper portions and circular lower portions, and related methods
US-12324154-B2 · Jun 3, 2025 · US
Memory devices including staircase structures
US-2025132248-A1 · Apr 24, 2025 · US
Microelectronic devices with active source/drain contacts in trench in symmetrical dual-block structure, and related methods
US-2025107204-A1 · Mar 27, 2025 · US
Electronic devices comprising multilevel bitlines, and related methods and systems
US-12237259-B2 · Feb 25, 2025 · US
Low resistance enhanced aspect ratio connector for semiconductor device assembly
US-2025046711-A1 · Feb 6, 2025 · US
Microelectronic devices including staircase structures, and related memory devices, electronic systems, and methods
US-12191249-B2 · Jan 7, 2025 · US
Microelectronic devices with active source/drain contacts in trench in symmetrical dual-block structure, and related systems and methods
US-12166094-B2 · Dec 10, 2024 · US
Memory array structures and methods of their fabrication
US-2024395326-A1 · Nov 28, 2024 · US
Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assemblies
US-12150303-B2 · Nov 19, 2024 · US
Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells
US-12068255-B2 · Aug 20, 2024 · US
String driver connections for wafer on wafer packaging
US-2024274533-A1 · Aug 15, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Micron Technology Inc | 156 |
| Lodestar Licensing Group Llc | 5 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10B43/27 | 119 |
| H10B41/27 | 94 |
| H01L27/11582 | 80 |
| H10B43/35 | 76 |
| H10B43/10 | 66 |