Semiconductor packages and methods for forming semiconductor package
US-10381280-B2 · Aug 13, 2019 · US
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Suthiwongsunthorn Nathapong patents
Suthiwongsunthorn Nathapong is listed as an inventor on 26 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Suthiwongsunthorn Nathapong |
| Total patents | 26 |
| First publication | Apr 30, 2015 |
| Latest publication | Aug 13, 2019 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor packages and methods of packaging semiconductor devices
US-10354934-B2 · Jul 16, 2019 · US
Semiconductor packages and methods of packaging semiconductor devices
US-2018240726-A1 · Aug 23, 2018 · US
Semiconductor packages and methods of packaging semiconductor devices
US-9978658-B2 · May 22, 2018 · US
Semiconductor packages and methods of packaging semiconductor devices
US-9881863-B2 · Jan 30, 2018 · US
Semiconductor device and method of forming a thin wafer without a carrier
US-9842775-B2 · Dec 12, 2017 · US
Semiconductor packages and methods for forming semiconductor package
US-2017294401-A1 · Oct 12, 2017 · US
Methods for singulating semiconductor wafer
US-9741619-B2 · Aug 22, 2017 · US
Semiconductor packages and methods of packaging semiconductor devices
US-2017148722-A1 · May 25, 2017 · US
Methods for singulating semiconductor wafer
US-2017117185-A1 · Apr 27, 2017 · US
Recent patents
Latest publications not already listed above.
Semiconductor packages and methods for forming semiconductor package
US-9613877-B2 · Apr 4, 2017 · US
Semiconductor packages and methods of packaging semiconductor devices
US-2017077007-A1 · Mar 16, 2017 · US
Semiconductor packages and methods of packaging semiconductor devices
US-9589875-B2 · Mar 7, 2017 · US
Semiconductor device and method of forming a shielding layer between stacked semiconductor die
US-9583446-B2 · Feb 28, 2017 · US
Methods for singulating semiconductor wafer
US-9570314-B2 · Feb 14, 2017 · US
Semiconductor packages and methods of packaging semiconductor devices
US-9508623-B2 · Nov 29, 2016 · US
Semiconductor Device and Method of Forming a Thin Wafer Without a Carrier
US-2016336230-A1 · Nov 17, 2016 · US
Leadframe area array packaging technology
US-9472532-B2 · Oct 18, 2016 · US
Semiconductor device and method of forming a thin wafer without a carrier
US-9443762-B2 · Sep 13, 2016 · US
Methods for singulating semiconductor wafer
US-2016104626-A1 · Apr 14, 2016 · US
Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die
US-9236352-B2 · Jan 12, 2016 · US
Semiconductor packages and methods of packaging semiconductor devices
US-2015380346-A1 · Dec 31, 2015 · US
Semiconductor packages and methods of packaging semiconductor devices
US-2015357256-A1 · Dec 10, 2015 · US
Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support
US-9054083-B2 · Jun 9, 2015 · US
Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support
US-9029193-B2 · May 12, 2015 · US
Semiconductor Device and Method of Forming a Shielding Layer Between Stacked Semiconductor Die
US-2015115394-A1 · Apr 30, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Utac Headquarters Pte Ltd | 18 |
| Stats Chippac Ltd | 6 |
| Stats Chippac Pte Ltd | 4 |
| United Test And Assembly Center Ltd | 2 |
| Suthiwongsunthorn Nathapong | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/129 | 17 |
| H10W74/00 | 15 |
| H10W72/884 | 15 |
| H10W74/014 | 15 |
| H10W72/252 | 14 |