Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps
US-RE47923-E · Mar 31, 2020 · US
Stats Chippac Ltd holds 458 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 458 |
| Recent patents | 0 |
| First publication | Jan 1, 2015 |
| Latest publication | Mar 31, 2020 |
Year-over-year patent counts for this assignee.
Latest publications where this party is an assignee.
US-RE47923-E · Mar 31, 2020 · US
US-10580749-B2 · Mar 3, 2020 · US
US-10453785-B2 · Oct 22, 2019 · US
US-10418298-B2 · Sep 17, 2019 · US
US-RE47600-E · Sep 10, 2019 · US
Representative or frequently cited publications from precomputed assignee stats.
US-RE47923-E · Mar 31, 2020 · US
US-10580749-B2 · Mar 3, 2020 · US
US-10453785-B2 · Oct 22, 2019 · US
US-10418298-B2 · Sep 17, 2019 · US
US-RE47600-E · Sep 10, 2019 · US
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W74/00 | 361 |
| H10W72/0198 | 295 |
| H01L2924/00 | 279 |
| H10W90/724 | 273 |
| H10W90/00 | 259 |
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 457 |
| Cross-Sectional Technologies | 12 |
| Operations & Transport | 9 |
| Physics | 1 |
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