Copper alloy powder for lamination shaping, lamination shaped product production method, and lamination shaped product
US-2025083227-A1 · Mar 13, 2025 · US
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Shibuya Yoshitaka patents
Shibuya Yoshitaka is listed as an inventor on 47 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Shibuya Yoshitaka |
| Total patents | 47 |
| First publication | Jan 8, 2015 |
| Latest publication | Mar 13, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Magnesium oxide sputtering target
US-12224166-B2 · Feb 11, 2025 · US
Pure copper or copper alloy powder for additive manufacturing
US-2024335874-A1 · Oct 10, 2024 · US
Production method of additive manufactured object using pure copper powder having Si coating
US-11872647-B2 · Jan 16, 2024 · US
Copper alloy powder having Si coating film and method for producing same
US-11872624-B2 · Jan 16, 2024 · US
Soft magnetic body, magnetic core, and electronic component
US-2023307178-A1 · Sep 28, 2023 · US
Power line communication device
US-11569867-B2 · Jan 31, 2023 · US
COPPER ALLOY POWDER HAVING Si COATING FILM AND METHOD FOR PRODUCING SAME
US-2022362844-A1 · Nov 17, 2022 · US
Pure copper powder having Si coating and production method thereof, and additive manufactured object using said pure copper powder
US-11498122-B2 · Nov 15, 2022 · US
Microcapsule for latent heat storage materials, method for producing same, powder containing microcapsules for latent heat storage materials, and heat storage device comprising said powder
US-2022298401-A1 · Sep 22, 2022 · US
Recent patents
Latest publications not already listed above.
MgO sintered sputtering target
US-11345990-B2 · May 31, 2022 · US
Potassium sodium niobate sputtering target
US-11313029-B2 · Apr 26, 2022 · US
Metal powder for metal additive manufacturing and molded object produced using said metal powder
US-11260451-B2 · Mar 1, 2022 · US
Power line communication device
US-2021409069-A1 · Dec 30, 2021 · US
Magnesium oxide sputtering target
US-2021351023-A1 · Nov 11, 2021 · US
Power line communication device
US-11146309-B2 · Oct 12, 2021 · US
Semiconductor device, angle value correction circuit and method therefor
US-10969400-B2 · Apr 6, 2021 · US
PURE COPPER POWDER HAVING Si COATING AND PRODUCTION METHOD THEREOF, AND ADDITIVE MANUFACTURED OBJECT USING SAID PURE COPPER POWDER
US-2021053114-A1 · Feb 25, 2021 · US
PRODUCTION METHOD OF ADDITIVE MANUFACTURED OBJECT USING PURE COPPER POWDER HAVING Si COATING
US-2021039192-A1 · Feb 11, 2021 · US
Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same
US-10826203-B2 · Nov 3, 2020 · US
Potassium sodium niobate sputtering target
US-2020340096-A1 · Oct 29, 2020 · US
MgO SINTERED SPUTTERING TARGET
US-2020263291-A1 · Aug 20, 2020 · US
Power line communication device
US-2020212958-A1 · Jul 2, 2020 · US
Metal powder for metal additive manufacturing and molded object produced using said metal powder
US-2020188995-A1 · Jun 18, 2020 · US
Copper alloy powder for lamination shaping, lamination shaped product production method, and lamination shaped product
US-2020122229-A1 · Apr 23, 2020 · US
Communication system, communication device, and communication method
US-10630522-B2 · Apr 21, 2020 · US
Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same
US-10594066-B2 · Mar 17, 2020 · US
Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same
US-10530084-B2 · Jan 7, 2020 · US
Communication system, communication device, and communication method
US-2019253297-A1 · Aug 15, 2019 · US
Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same
US-10373730-B2 · Aug 6, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Jx Nippon Mining & Metals Corp | 38 |
| Renesas Electronics Corp | 8 |
| Shibuya Yoshitaka | 3 |
| Jx Metals Corp | 2 |
| Jx Nippin Mining & Metals Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.