Copper alloy powder for lamination shaping, lamination shaped product production method, and lamination shaped product

US2020122229A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2020122229-A1
Application numberUS-201816605358-A
CountryUS
Kind codeA1
Filing dateJun 15, 2018
Priority dateAug 21, 2017
Publication dateApr 23, 2020
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An object of the present invention is to provide a copper alloy powder for lamination shaping comprising a copper alloy, a method for producing a lamination shaped product and a lamination shaped product, which can achieve coexistence of mechanical strength and conductivity. One aspect of the present invention relates to a copper alloy powder for lamination shaping, comprising at least one additive element having a solid solution amount to copper of less than 0.2 at %.

First claim

Opening claim text (preview).

1 . A copper alloy powder for lamination shaping, comprising at least one additive element having a solid solution amount to copper of less than 0.2 at %. 2 . The copper alloy powder for lamination shaping according to claim 1 , wherein the additive element is at least one selected from the group consisting of W, Zr, Nb, Nd, Y, Mo, Os or Ru. 3 . The copper alloy powder for lamination shaping according to claim 1 , wherein the copper alloy powder contains the additive element in an amount of from 0.1 to 12.0 at %. 4 . The copper alloy powder for lamination shaping according to claim 1 , wherein the copper alloy powder has an average particle diameter D50 of from 20 to 100 μm. 5 . The copper alloy powder for lamination shaping according to claim 1 , wherein the capper alloy powder has an oxygen concentration of 1000 wtppm or less. 6 . A method for producing a lamination shaped product using the copper alloy powder for lamination shaping according to claim 1 , the method comprising the steps of: spreading the copper alloy powder on a shaping stage to form a thin layer thereon; and irradiating a portion of the thin layer to be shaped with an electron beam to melt the copper alloy powder and then solidifying the molten copper alloy powder by natural cooling; wherein the steps are repeated several times to produce a lamination shaped product. 7 . A method for producing a lamination shaped product using the copper alloy powder for lamination shaping according to claim 1 , the method comprising the steps of: spreading the copper alloy powder on a shaping stage to form a thin layer thereon; and irradiating a portion of the thin layer to be shaped with a laser beam to melt the copper alloy powder and then solidifying the molten copper alloy powder by natural cooling; wherein the steps are repeated several times to produce a lamination shaped product. 8 . A lamination shaped product comprising a copper alloy, wherein the copper alloy contains at least one additive element having a solid solution amount of less than 0.2 at %, and the copper alloy has a relative density of 98% or more relative to theoretical density; a conductivity of 50% IACS or more, and a 0.2% yield strength of 700 MPa or more. 9 . The lamination shaped product according to claim 8 , wherein the additive element is at least one selected from the group consisting of W, Zr, Nb, Nd, Y, Mo, Os or Ru. 10 . The lamination shaped product according to claim 8 , wherein the copper alloy powder contains the additive element in an amount of from 0.1 to 12.0 at %.

Assignees

Inventors

Classifications

  • Products made by additive manufacturing · CPC title

  • Use of irradiation · CPC title

  • Copper · CPC title

  • in successive or repeated steps · CPC title

  • Processes characterised by the sequence of their steps · CPC title

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What does patent US2020122229A1 cover?
An object of the present invention is to provide a copper alloy powder for lamination shaping comprising a copper alloy, a method for producing a lamination shaped product and a lamination shaped product, which can achieve coexistence of mechanical strength and conductivity. One aspect of the present invention relates to a copper alloy powder for lamination shaping, comprising at least one addi…
Who is the assignee on this patent?
Jx Nippon Mining & Metals Corp
What technology area does this patent fall under?
Primary CPC classification B33Y70/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Apr 23 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).