Metal powder for metal additive manufacturing and molded object produced using said metal powder

US2020188995A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2020188995-A1
Application numberUS-201816348566-A
CountryUS
Kind codeA1
Filing dateJun 21, 2018
Priority dateSep 29, 2017
Publication dateJun 18, 2020
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A metal powder in which a coating made of one or more types of elements selected from Gd, Ho, Lu, Mo, Nb, Os, Re, Ru, Tb, Tc, Th, Tm, U, V, W, Y, Zr, Cr, Rh, Hf, La, Ce, Pr, Nd, Pm, Sm and Ti is formed on a surface of a copper or copper alloy powder, wherein a thickness of the coating is 5 nm or more and 500 nm or less. A metal powder for metal additive manufacturing based on the laser method which can be efficiently melted with a laser while maintaining the high conductivity of copper or copper alloy, and a molded object produced by using such metal powder are provided.

First claim

Opening claim text (preview).

1 . A metal powder in which a coating made of one or more types of elements selected from Gd, Ho, Lu, Mo, Nb, Os, Re, Ru, Tb, Tc, Th, Tm, U, V, W, Y, Zr, Cr, Rh, Hf, La, Ce, Pr, Nd, Pm, Sm and Ti is formed on a surface of a copper or copper alloy powder, wherein a thickness of the coating is 5 nm or more and 500 nm or less. 2 . The metal powder according to claim 1 , wherein a grain size d 50 of the copper or copper alloy powder is 20 μm or more and 100 μm or less. 3 . The metal powder according to claim 2 , wherein an oxygen concentration of the copper or copper alloy powder is 1000 wtppm or less. 4 . A metal laminate molded object produced by using the metal powder according to claim 1 , wherein a conductivity of the metal laminate molded object is 90% IACS or higher. 5 . The metal laminate molded object according to claim 4 , wherein a relative density of the metal laminate molded object is 97% or higher. 6 . The metal powder according to claim 1 , wherein an oxygen concentration of the copper or copper alloy powder is 1000 wtppm or less.

Assignees

Inventors

Classifications

  • Direct sintering or melting · CPC title

  • characterised by the type, e.g. laser or electron beam · CPC title

  • of powder characteristics, e.g. density, oxidation or flowability · CPC title

  • B22F1/05Primary

    Metallic powder characterised by the size or surface area of the particles · CPC title

  • Metallic particles coated with metal · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2020188995A1 cover?
A metal powder in which a coating made of one or more types of elements selected from Gd, Ho, Lu, Mo, Nb, Os, Re, Ru, Tb, Tc, Th, Tm, U, V, W, Y, Zr, Cr, Rh, Hf, La, Ce, Pr, Nd, Pm, Sm and Ti is formed on a surface of a copper or copper alloy powder, wherein a thickness of the coating is 5 nm or more and 500 nm or less. A metal powder for metal additive manufacturing based on the laser method w…
Who is the assignee on this patent?
Jx Nippon Mining & Metals Corp
What technology area does this patent fall under?
Primary CPC classification B22F1/05. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Jun 18 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).