Copper alloy powder for lamination shaping, lamination shaped product production method, and lamination shaped product

Patent metadata

Field	Value
Publication number	US-2025083227-A1
Application number	US-202418951748-A
Country	US
Kind code	A1
Filing date	Nov 19, 2024
Priority date	Aug 21, 2017
Publication date	Mar 13, 2025
Grant date	—

Abstract

An object of the present invention is to provide a copper alloy powder for lamination shaping comprising a copper alloy, a method for producing a lamination shaped product and a lamination shaped product, which can achieve coexistence of mechanical strength and conductivity. One aspect of the present invention relates to a copper alloy powder for lamination shaping, including at least one additive element having a solid solution amount to copper of less than 0.2 at %.

First claim

What is claimed is:

1 . A method for producing a lamination shaped product using a copper alloy powder for lamination shaping comprising at least one additive element having a solid solution amount to copper of less than 0.2 at %, the method comprising the steps of:
spreading the copper alloy powder on a shaping stage to form a thin layer thereon; and irradiating a portion of the thin layer to be shaped with an electron beam to melt the copper alloy powder and then solidifying the molten copper alloy powder by natural cooling; wherein the steps are repeated several times to produce a lamination shaped product.

2 . A method for producing a lamination shaped product using a copper alloy powder for lamination shaping comprising at least one additive element having a solid solution amount to copper of less than 0.2 at %, the method comprising the steps of:
spreading the copper alloy powder on a shaping stage to form a thin layer thereon; and irradiating a portion of the thin layer to be shaped with a laser beam to melt the copper alloy powder and then solidifying the molten copper alloy powder by natural cooling; wherein the steps are repeated several times to produce a lamination shaped product.

3 . A lamination shaped product comprising a copper alloy, wherein the copper alloy contains at least one additive element having a solid solution amount of less than 0.2 at %, and the copper alloy has a relative density of 98% or more relative to theoretical density; a conductivity of 50% IACS or more, and a 0.2% yield strength of 700 MPa or more.

4 . The lamination shaped product according to claim 3 , wherein the additive element is at least one selected from the group consisting of W, Zr, Nb, Nd, Y, Mo, Os or Ru.

5 . The lamination shaped product according to claim 3 , wherein the copper alloy powder contains the additive element in an amount of from 0.1 to 12.0 at %.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Sato Kenji
• Shibuya Yoshitaka

Classifications

• B22F1/00

  Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties · CPC title

• B22F10/38

  to achieve specific product aspects, e.g. surface smoothness, density, porosity or hollow structures · CPC title

• B22F1/05

  Metallic powder characterised by the size or surface area of the particles · CPC title

• B22F10/28

  Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

• C22C9/00

  Alloys based on copper · CPC title