Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same

Patent metadata

Field	Value
Publication number	US-10530084-B2
Application number	US-201314411789-A
Country	US
Kind code	B2
Filing date	Jun 27, 2013
Priority date	Jun 27, 2012
Publication date	Jan 7, 2020
Grant date	Jan 7, 2020

Abstract

The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials. The metallic material for electronic components includes: a base material; a lower layer formed on the base material, the lower layer being constituted with one or two or more selected from a constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu; an intermediate layer formed on the lower layer, the intermediate layer being constituted with one or two or more selected from a constituent element group B, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir; an upper layer formed on the intermediate layer, the upper layer being constituted with an alloy composed of one or two or more selected from the constituent element group B, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir and one or two selected from a constituent element group C, namely, the group consisting of Sn and In; an outermost layer formed on the upper layer, the upper layer being constituted with one or two selected from the constituent element group C, namely, the group consisting of Sn and In, wherein the thickness of the lower layer is 0.05 μm or more and less than 5.00 μm; the thickness of the intermediate layer is 0.01 μm or more and less than 0.50 μm; the thickness of the upper layer is less than 0.50 μm; and the thickness of the outermost layer is 0.005 μm or more and less than 0.30 μm.

First claim

The invention claimed is:

1. A metallic material for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, the material comprising:
a base material;
a lower layer formed on the base material, the lower layer consisting of one or two or more selected from a constituent element group A consisting of Ni, Cr, Mn, Fe, Co and Cu;
an intermediate layer formed on the lower layer, the intermediate layer consisting of one or two or more selected from a constituent element group B consisting of Ag, Au, Pt, Rh, Os and Ir;
an upper layer formed on the intermediate layer, the upper layer consisting of an alloy consisting of one or two or more selected from the constituent element group B and one or two selected from a constituent element group C consisting of Sn and In; and
an outermost layer formed on the upper layer, the outermost layer consisting of one metal, which metal is selected from the constituent element group C,
wherein the thickness of the lower layer is 0.05 μm or more and less than 5.00 μm; the thickness of the intermediate layer is 0.01 μm or more and less than 0.50 μm; the thickness of the upper layer is less than 0.50 μm; and the thickness of the outermost layer is 0.005 μm or more and less than 0.30 μm.

2. The metallic material for electronic components according to claim 1 , wherein the maximum value (μm) of the elevation differences between adjacent hills and valleys in a profile of an interface between the outermost layer and the upper layer is 50% or less of the thickness (μm) of the outermost layer.

3. The metallic material for electronic components according to claim 1 , wherein the upper layer comprises the metal(s) of the constituent element group C in a content of 10 to 50 at %.

4. The metallic material for electronic components according to claim 1 , wherein a ζ (zeta)-phase being a Sn—Ag alloy and/or an ε (epsilon)-phase being a Sn—Ag alloy is present.

5. The metallic material for electronic components according to claim 1 , wherein a β-Sn being a Sn single phase is further present.

6. The metallic material for electronic components according to claim 1 , wherein the thickness ratio between the outermost layer and the upper layer is such that outermost layer:upper layer=1:9 to 6:4.

7. The metallic material for electronic components according to claim 1 , wherein the indentation hardness of the surface of the outermost layer, the hardness being obtained by hitting a dent on the surface of the outermost layer with a load of 10 mN on the basis of a nanoindentation hardness test, is 1000 MPa or more.

8. The metallic material for electronic components according to claim 1 , wherein the indentation hardness measured from the surface of the outermost layer, the hardness being obtained by hitting a dent on the surface of the outermost layer with a load of 10 mN on the basis of a nanoindentation hardness test, is 10000 MPa or less.

9. A metallic material for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, the material comprising:
a base material;
a lower layer formed on the base material, the lower layer consisting of an alloy comprising one or two or more selected from a constituent element group A consisting of Ni, Cr, Mn, Fe, Co and Cu;
an intermediate layer formed on the lower layer, the intermediate layer consisting of one or two or more selected from a constituent element group B consisting of Ag, Au, Pt, Rh, Os and Ir;
an upper layer formed on the intermediate layer, the upper layer consisting of an alloy consisting of one or two or more selected from the constituent element group B and one or two selected from a constituent element group C consisting of Sn and In; and
an outermost layer formed on the upper layer, the outermost layer consisting of one metal, which metal is selected from the constituent element group C,
wherein the thickness of the lower layer is 0.05 μm or more and less than 5.00 μm; the thickness of the intermediate layer is 0.01 μm or more and less than 0.50 μm; the thickness of the upper layer is less than 0.50 μm; and the thickness of the outermost layer is 0.005 μm or more and less than 0.30 μm, and
wherein in the lower layer the content of the metal(s) of the constituent element group A is 50% by mass or more in terms of the total content of Ni, Cr, Mn, Fe, Co and Cu, and the rest of the alloy consists of one or two or more selected from a group consisting of B, P, Sn and Zn.

10. A metallic material for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, the material comprising:
a base material;
a lower layer formed on the base material, the lower layer consisting of one or two or more selected from a constituent element group A consisting of Ni, Cr, Mn, Fe, Co and Cu;
an intermediate layer formed on the lower layer, the intermediate layer consisting of an alloy comprising one or two or more selected from a constituent element group B consisting of Ag, Au, Pt, Rh, Os and Ir;
an upper layer formed on the intermediate layer, the upper layer consisting of an alloy composed of one or two or more selected from the constituent element group B and one or two selected from a constituent element group C consisting of Sn and In; and
an outermost layer formed on the upper layer, the outermost layer consisting of one metal, which metal is selected from the constituent element group C,
wherein the thickness of the lower layer is 0.05 μm or more and less than 5.00 μm; the thickness of the intermediate layer is 0.01 μm or more and less than 0.50 μm; the thickness of the upper layer is less than 0.50 μm; and the thickness of the outermost layer is 0.005 μm or more and less than 0.30 μm, and
wherein in the intermediate layer the content of the metal(s) of the constituent element group B is 50% by mass or more in terms of the total content of Ag, Au, Pt, Rh, Os and Ir, and the rest of the alloy component consists of one or two or more selected from the group consisting of Bi, Cd, Co, Cu, Fe, In, Mn, Mo, Ni, Pb, Sb, Se, Sn, W, Tl and Zn.

11. A metallic material for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, the material comprising:
a base material;
a lower layer formed on the base material, the lower layer consisting of one or two or more selected from a constituent element group A consisting of Ni, Cr, Mn, Fe, Co and Cu;
an intermediate layer formed on the lower layer, the intermediate layer consisting of one or two or more selected from a constituent element group B consisting of Ag, Au, Pt, Rh, Os and Ir;
an upper layer formed on the intermediate layer, the upper layer consisting of an alloy comprising one or two or more selected from the constituent element group B and one or two selected from a constituent element group C consisting of Sn and In; and
an outermost layer formed on the upper layer, the outermost layer consisting of one metal, which metal is selected from the constituent element group C,
wherein the thickness of the lower layer is 0.05 μm or more and less than 5.00 μm; the thickness of the intermediate layer is 0.01 μm or more and less than 0.50 μm; the thickness of the upper layer is less than 0.50 μm; and the thickness of the outermost layer is 0.005 μm or more and less than 0.30 μm, and
wherein in the upper layer the content of the metal(s) of the constituent element group C is 50% by mass or more in terms of the total content of Sn and In, and the rest of the alloy component consists of one or two or more selected from the group consisting of Ag, As, Au, Bi, Cd, Co, Cr, Cu, Fe, Mn, Mo, Ni, Pb, S

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Shibuya Yoshitaka
• Fukamachi Kazuhiko
• Kodama Atsushi

Classifications

• C25D11/36

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• C25D9/06

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• C25D3/46

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• C25D3/18

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• C23C18/165

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