Copper alloy powder having Si coating film and method for producing same

Patent metadata

Field	Value
Publication number	US-11872624-B2
Application number	US-202117771552-A
Country	US
Kind code	B2
Filing date	Jun 25, 2021
Priority date	Jun 26, 2020
Publication date	Jan 16, 2024
Grant date	Jan 16, 2024

Abstract

Provided is a copper alloy powder which is a metal powder to be used for additive manufacturing by a laser beam system, and which is able to achieve a higher laser absorption rate and additionally suppress heat transfer through necking, and a method for producing this copper alloy powder. A copper alloy powder which contains one or more elements selected from among Cr, Zr and Nb in a total amount of 15 wt % or less, with a balance being made up of Cu and unavoidable impurities, and which is characterized in that a coating film containing Si atoms is formed on the copper alloy powder, and a Si concentration in the copper alloy powder with the coating film is 5 wt ppm or more and 700 wt ppm or less.

First claim

The invention claimed is:

1. A copper alloy powder which contains one or more elements selected from among Cr, Zr and Nb in a total amount of 15 wt % or less, with a balance being made up of Cu and unavoidable impurities, and which is characterized in that a coating film containing Si atoms is formed on the copper alloy powder, a Si concentration in the copper alloy powder with the coating film is 5 wt ppm or more and 700 wt ppm or less, when a 2p spectrum of Si is analyzed based on XPS analysis in the copper alloy powder with the coating film, a maximum peak intensity exists in a binding energy range of 101 to 105 eV, and, when analysis is performed based on Raman analysis in the copper alloy powder with the coating film containing Si atoms, a maximum scattering intensity value in a Raman shift range of 1000 to 2000 cm −1 exists in a range of 1200 to 1850 cm −1 .

2. A copper alloy powder which contains Cr in an amount of 15 wt % or less, with a balance being made up of Cu and unavoidable impurities, and which is characterized in that a coating film containing Si atoms is formed on the copper alloy powder, a Si concentration in the copper alloy powder with the coating film is 5 wt ppm or more and 700 wt ppm or less, when a 2p spectrum of Si is analyzed based on XPS analysis in the copper alloy powder with the coating film, a maximum peak intensity exists in a binding energy range of 101 to 105 eV, and, when analysis is performed based on Raman analysis in the copper alloy powder with the coating film containing Si atoms, a maximum scattering intensity value in a Raman shift range of 1000 to 2000 cm −1 exists in a range of 1200 to 1850 cm −1 .

3. A copper alloy powder which contains Cr in an amount of 12 wt % or less and Zr in an amount of 3 wt % or less, with a balance being made up of Cu and unavoidable impurities, and which is characterized in that a coating film containing Si atoms is formed on the copper alloy powder, a Si concentration in the copper alloy powder with the coating film is 5 wt ppm or more and 700 wt ppm or less, when a 2p spectrum of Si is analyzed based on XPS analysis in the copper alloy powder with the coating film, a maximum peak intensity exists in a binding energy range of 101 to 105 eV, and, when analysis is performed based on Raman analysis in the copper alloy powder with the coating film containing Si atoms, a maximum scattering intensity value in a Raman shift range of 1000 to 2000 cm −1 exists in a range of 1200 to 1850 cm −1 .

4. A copper alloy powder which contains Cr in an amount of 8 wt % or less and Nb in an amount of 7 wt % or less, with a balance being made up of Cu and unavoidable impurities, and which is characterized in that a coating film containing Si atoms is formed on the copper alloy powder, a Si concentration in the copper alloy powder with the coating film is 5 wt ppm or more and 700 wt ppm or less, when a 2p spectrum of Si is analyzed based on XPS analysis in the copper alloy powder with the coating film, a maximum peak intensity exists in a binding energy range of 101 to 105 eV, and, when analysis is performed based on Raman analysis in the copper alloy powder with the coating film containing Si atoms, a maximum scattering intensity value in a Raman shift range of 1000 to 2000 cm −1 exists in a range of 1200 to 1850 cm −1 .

5. The copper alloy powder according to claim 4 , wherein an oxygen concentration in the copper alloy powder with the coating film containing Si atoms is 2000 wt ppm or less.

6. The copper alloy powder according to claim 4 , wherein, when an LMM spectrum of Cu is analyzed based on XPS analysis in the copper alloy powder with the coating film containing Si atoms, a maximum peak intensity exists in a binding energy range of 569 to 571 eV.

7. The copper alloy powder according to claim 4 , wherein an average particle diameter D50 (median diameter) in the copper alloy powder is 10 μm or more and 150 μm or less.

8. A method of producing the copper alloy powder according to claim 4 , wherein a copper alloy powder is immersed in a solution containing a silane-based coupling agent, a coating film containing Si atoms is formed on the copper alloy powder, and the copper alloy powder is thereafter heated at a temperature of 1000° C. or less.

9. The copper alloy powder according to claim 3 , wherein an oxygen concentration in the copper alloy powder with the coating film containing Si atoms is 2000 wt ppm or less.

10. The copper alloy powder according to claim 3 , wherein, when an LMM spectrum of Cu is analyzed based on XPS analysis in the copper alloy powder with the coating film containing Si atoms, a maximum peak intensity exists in a binding energy range of 569 to 571 eV.

11. The copper alloy powder according to claim 3 , wherein an average particle diameter D50 (median diameter) in the copper alloy powder is 10 μm or more and 150 μm or less.

12. A method of producing the copper alloy powder according to claim 3 , wherein a copper alloy powder is immersed in a solution containing a silane-based coupling agent, a coating film containing Si atoms is formed on the copper alloy powder, and the copper alloy powder is thereafter heated at a temperature of 1000° C. or less.

13. The copper alloy powder according to claim 2 , wherein an oxygen concentration in the copper alloy powder with the coating film containing Si atoms is 2000 wt ppm or less.

14. The copper alloy powder according to claim 2 , wherein, when an LMM spectrum of Cu is analyzed based on XPS analysis in the copper alloy powder with the coating film containing Si atoms, a maximum peak intensity exists in a binding energy range of 569 to 571 eV.

15. The copper alloy powder according to claim 2 , wherein an average particle diameter D50 (median diameter) in the copper alloy powder is 10 μm or more and 150 μm or less.

16. A method of producing the copper alloy powder according to claim 2 , wherein a copper alloy powder is immersed in a solution containing a silane-based coupling agent, a coating film containing Si atoms is formed on the copper alloy powder, and the copper alloy powder is thereafter heated at a temperature of 1000° C. or less.

17. The copper alloy powder according to claim 1 , wherein an oxygen concentration in the copper alloy powder with the coating film containing Si atoms is 2000 wt ppm or less.

18. The copper alloy powder according to claim 1 , wherein, when an LMM spectrum of Cu is analyzed based on XPS analysis in the copper alloy powder with the coating film containing Si atoms, a maximum peak intensity exists in a binding energy range of 569 to 571 eV.

19. The copper alloy powder according to claim 1 , wherein an average particle diameter D50 (median diameter) in the copper alloy powder is 10 μm or more and 150 μm or less.

20. A method of producing the copper alloy powder according to claim 1 , wherein a copper alloy powder is immersed in a solution containing a silane-based coupling agent, a coating film containing Si atoms is formed on the copper alloy powder, and the copper alloy powder is thereafter heated at a temperature of 1000° C. or less.

Assignees

• Jx Nippon Mining & Metals Corp
• Jx Metals Corp

Inventors

• Watanabe Hirofumi
• Shibuya Yoshitaka

Classifications

• Y02P10/25

  Process efficiency · CPC title

• B22F2301/10

  Copper · CPC title

• B22F1/16 Primary

  Metallic particles coated with a non-metal (coated with lubricating or binding agents or with organic material B22F1/10) · CPC title

• B22F1/05

  Metallic powder characterised by the size or surface area of the particles · CPC title

• B22F2304/10

  Micron size particles, i.e. above 1 micrometer up to 500 micrometer · CPC title