Pure copper or copper alloy powder for additive manufacturing

Patent metadata

Field	Value
Publication number	US-2024335874-A1
Application number	US-202218580000-A
Country	US
Kind code	A1
Filing date	Aug 30, 2022
Priority date	Sep 1, 2021
Publication date	Oct 10, 2024
Grant date	—

Abstract

An object of the present invention is to provide a pure copper or copper alloy powder for use in additive manufacturing using a laser beam system, and which is capable of increasing the laser absorptance and simultaneously decreasing the oxygen concentration in an object. Provided is a pure copper or copper alloy powder with an oxide coating, wherein the oxide coating contains carbon, and a ratio of the oxygen concentration to the carbon concentration ((oxygen concentration)/(carbon concentration)) is 5 or less.

First claim

1 . A pure copper or copper alloy powder with an oxide coating, wherein the oxide coating contains carbon, and a ratio of an oxygen concentration to a carbon concentration (oxygen concentration/carbon concentration) is 5 or less, the carbon has a graphite structure, and a film thickness of the oxide coating is 5 nm or more and 500 nm or less.

2 . The pure copper or copper alloy powder according to claim 1 , wherein the oxygen concentration is 5000 wtppm or less.

3 . The pure copper and or copper alloy powder according to claim 2 , wherein the carbon concentration is 100 wtppm or more.

4 . (canceled)

5 . The pure copper or copper alloy powder according to claim 3 , wherein, when measured based on Raman spectroscopy, a maximum scattering intensity value in a Raman shift of 1000 to 2000 cm −1 exists within a range of a Raman shift of 1300 to 1700 cm −1 .

6 . The pure copper or copper alloy powder according to claim 5 , wherein, when a Cu LMM spectrum is analyzed with XPS, a maximum peak intensity exists at a binding energy of 569 to 571 eV.

7 . (canceled)

8 . The pure copper or copper alloy powder according to claim 6 , wherein an average particle size D 50 (median diameter) is 10 μm or more and 150 μm or less.

9 . The pure copper or copper alloy powder according to claim 8 , wherein the pure copper or copper alloy powder is a copper alloy containing pure copper or copper in an amount of 80 wt % or higher.

10 . The pure copper or copper alloy powder according to claim 9 , wherein the pure copper or copper alloy powder is used for additive manufacturing using a laser beam.

11 . The pure copper or copper alloy powder according to claim 1 , wherein the carbon concentration is 100 wtppm or more.

12 . The pure copper or copper alloy powder according to claim 1 , wherein, when measured based on Raman spectroscopy, a maximum scattering intensity value in a Raman shift of 1000 to 2000 cm −1 exists within a range of a Raman shift of 1300 to 1700 cm −1 .

13 . The pure copper or copper alloy powder according to claim 1 , wherein, when a Cu LMM spectrum is analyzed with XPS, a maximum peak intensity exists at a binding energy of 569 to 571 eV.

14 . The pure copper or copper alloy powder according to claim 1 , wherein an average particle size D 50 (median diameter) is 10 μm or more and 150 μm or less.

15 . The pure copper or copper alloy powder according to claim 1 , wherein the pure copper or copper alloy powder is a copper alloy containing pure copper or copper in an amount of 80 wt % or higher.

16 . The pure copper or copper alloy powder according to claim 1 , wherein the pure copper or copper alloy powder is used for additive manufacturing using a laser beam.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Watanabe Hirofumi
• Shibuya Yoshitaka
• Kumagai Masashi

Classifications

• B22F10/34

  of powder characteristics, e.g. density, oxidation or flowability · CPC title

• B33Y70/10

  Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials · CPC title

• B22F2304/10

  Micron size particles, i.e. above 1 micrometer up to 500 micrometer · CPC title

• B22F2302/40

  Carbon, graphite · CPC title

• B22F2301/10

  Copper · CPC title