Piezoelectric thin film, piezoelectric thin film device, target, and methods for manufacturing piezoelectric thin film and piezoelectric thin film device
US-2016365503-A1 · Dec 15, 2016 · US
US2020340096A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020340096-A1 |
| Application number | US-202016842896-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 8, 2020 |
| Priority date | Apr 26, 2019 |
| Publication date | Oct 29, 2020 |
| Grant date | — |
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A sputtering target formed from a potassium sodium niobate sintered body to which a dopant has been added; as a dopant, the sputtering target includes one or more types among Li, Mg, Ca, Sr, Ba, Bi, Sb, V, In, Ta, Mo, W, Cr, Ti, Zr, Hf, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Cu, Zn, Ag, Mn, Fe, Co, Ni, Al, Si, Ge, Sn, and Ga; and a variation coefficient of a dopant concentration in a plane of the sputtering target is 0.12 or less. In terms of suppressing the generation of particles, provided is a sputtering target which is formed from a sintered body that includes potassium sodium niobate and to which a dopant has been added.
Opening claim text (preview).
We claim: 1 . A sputtering target formed from a potassium sodium niobate sintered body to which a dopant has been added, wherein the dopant contained is one or more types among Li, Mg, Ca, Sr, Ba, Bi, Sb, V, In, Ta, Mo, W, Cr, Ti, Zr, Hf, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Cu, Zn, Ag, Mn, Fe, Co, Ni, Al, Si, Ge, Sn, and Ga; and wherein a variation coefficient of a dopant concentration in a plane of the sputtering target is 0.12 or less. 2 . The sputtering target according to claim 1 , wherein a variation coefficient of a K/Na composition ratio in a plane of the sputtering target is 0.12 or less. 3 . The sputtering target according to claim 2 , wherein a relative density is 60% or higher. 4 . The sputtering target according to claim 2 , wherein a relative density is 70% or higher. 5 . The sputtering target according to claim 2 , wherein a relative density is 80% or higher. 6 . The sputtering target according to claim 5 , wherein a flexural strength is 10 MPa or more. 7 . The sputtering target according to claim 6 , wherein an average crystal grain size is 1 to 20 μm. 8 . The sputtering target according to claim 7 , wherein a content of carbon as a gas component is 1000 wtppm or less. 9 . The sputtering target according to claim 8 , wherein a content ratio of niobium (Nb), potassium (K), and sodium (Na) is, in terms of atomic ratio, Nb:K:Na=1.0:X:1-X, where 0.3≤X<1.0. 10 . The sputtering target according to claim 9 , wherein a total content of the dopant is 0.04 at % to 4 at %. 11 . The sputtering target according to claim 1 , wherein a relative density is 60% or higher. 12 . The sputtering target according to claim 1 , wherein a relative density is 70% or higher. 13 . The sputtering target according to claim 1 , wherein a relative density is 80% or higher. 14 . The sputtering target according to claim 1 , wherein a flexural strength is 10 MPa or more. 15 . The sputtering target according to claim 1 , wherein an average crystal grain size is 1 to 20 μm. 16 . The sputtering target according to claim 1 , wherein a content of carbon as a gas component is 1000 wtppm or less. 17 . The sputtering target according to claim 1 , wherein a content ratio of niobium (Nb), potassium (K), and sodium (Na) is, in terms of atomic ratio, Nb:K:Na=1.0:X:1-X, where 0.3≤X<1.0. 18 . The sputtering target according to claim 1 , wherein a total content of the dopant is 0.04 at % to 4 at %.
Cathode assembly for sputtering apparatus, e.g. Target · CPC title
Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy · CPC title
based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates · CPC title
of the type ABO3 with A representing alkali, alkaline earth metal or Pb and B representing a refractory or rare earth metal · CPC title
Oxides (C23C14/10 takes precedence) · CPC title
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