Method and structure to incorporate multiple low loss photonic circuit components
US-12498402-B2 · Dec 16, 2025 · US
This page is not indexed by search engines while we improve data quality.
Licausi Nicholas V patents
Licausi Nicholas V is listed as an inventor on 54 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Licausi Nicholas V |
| Total patents | 54 |
| First publication | Jan 1, 2015 |
| Latest publication | Dec 16, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Self aligned buried power rail
US-12142516-B2 · Nov 12, 2024 · US
Method and structure to incorporate multiple low loss photonic circuit components
US-2023366913-A1 · Nov 16, 2023 · US
Metal on metal multiple patterning
US-11398378-B2 · Jul 26, 2022 · US
Self aligned buried power rail
US-2022181198-A1 · Jun 9, 2022 · US
Self aligned buried power rail
US-11309210-B2 · Apr 19, 2022 · US
Fully aligned via in ground rule region
US-11114338-B2 · Sep 7, 2021 · US
Interconnect structures with airgaps arranged between capped interconnects
US-11101169-B2 · Aug 24, 2021 · US
Skip via for metal interconnects
US-10978388-B2 · Apr 13, 2021 · US
Metal on metal multiple patterning
US-2021005454-A1 · Jan 7, 2021 · US
Recent patents
Latest publications not already listed above.
Interconnect structure having reduced resistance variation and method of forming same
US-10832944-B2 · Nov 10, 2020 · US
Metal on metal multiple patterning
US-10818494-B2 · Oct 27, 2020 · US
Line end structures for semiconductor devices
US-10770392-B1 · Sep 8, 2020 · US
Interconnect structures with airgaps and dielectric-capped interconnects
US-2020227308-A1 · Jul 16, 2020 · US
Interconnect structures with airgaps arranged between capped interconnects
US-2020227307-A1 · Jul 16, 2020 · US
Interconnect structures with airgaps and dielectric-capped interconnects
US-10707119-B1 · Jul 7, 2020 · US
Structure, method and system for measuring RIE lag depth
US-10677855-B2 · Jun 9, 2020 · US
Interconnect structure having reduced resistance variation and method of forming same
US-2020144106-A1 · May 7, 2020 · US
Methods of identifying space within integrated circuit structure as mandrel space or non-mandrel space
US-10622266-B2 · Apr 14, 2020 · US
Skip via for metal interconnects
US-2020111736-A1 · Apr 9, 2020 · US
Metal on metal multiple patterning
US-2020083043-A1 · Mar 12, 2020 · US
Interconnects formed by a metal displacement reaction
US-10580696-B1 · Mar 3, 2020 · US
Interconnects formed by a metal displacement reaction
US-2020066585-A1 · Feb 27, 2020 · US
Self aligned buried power rail
US-2020006112-A1 · Jan 2, 2020 · US
Via and skip via structures
US-10485111-B2 · Nov 19, 2019 · US
Self aligned buried power rail
US-10475692-B2 · Nov 12, 2019 · US
Fully aligned via in ground rule region
US-2019311948-A1 · Oct 10, 2019 · US
Fully aligned via in ground rule region
US-10366919-B2 · Jul 30, 2019 · US
Back-end-of-line structures with air gaps
US-2019206718-A1 · Jul 4, 2019 · US
Method of forming complementary nano-sheet/wire transistor devices with same depth contacts
US-10304833-B1 · May 28, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Globalfoundries Inc | 43 |
| Globalfoundries Us Inc | 5 |
| IBM | 2 |
| Psiquantum Corp | 2 |
| Globalfoundaries Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/42 | 18 |
| H10W20/056 | 16 |
| H10W20/077 | 16 |
| H10D84/038 | 15 |
| H01L23/5226 | 14 |