Solder material, solder paste, and solder joint
US-11344976-B2 · May 31, 2022 · US
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Soma Daisuke patents
Soma Daisuke is listed as an inventor on 41 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Soma Daisuke |
| Total patents | 41 |
| First publication | Mar 5, 2015 |
| Latest publication | May 31, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Cu ball, Osp-treated Cu ball, Cu core ball, solder joint, solder paste, formed solder, and method for manufacturing Cu ball
US-11185950-B2 · Nov 30, 2021 · US
Cu core ball, solder joint, solder paste and formed solder
US-10888959-B2 · Jan 12, 2021 · US
Solder material, solder paste, and solder joint
US-2020376607-A1 · Dec 3, 2020 · US
Cu column, Cu core column, solder joint, and through-silicon via
US-10811376-B2 · Oct 20, 2020 · US
Cu Ball, Osp-Treated Cu Ball, Cu Core Ball, Solder Joint, Solder Paste, Formed Solder, and Method for Manufacturing Cu Ball
US-2020298349-A1 · Sep 24, 2020 · US
Solder material, solder paste, solder preform, solder joint and method of managing the solder material
US-10717157-B2 · Jul 21, 2020 · US
Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint
US-10675719-B2 · Jun 9, 2020 · US
Cu core ball, solder joint, solder paste and formed solder
US-10639749-B2 · May 5, 2020 · US
Flux composition for solder applications
US-10610979-B2 · Apr 7, 2020 · US
Recent patents
Latest publications not already listed above.
Solder material, solder paste, formed solder and solder joint
US-2020061757-A1 · Feb 27, 2020 · US
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
US-2019375054-A1 · Dec 12, 2019 · US
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
US-2019376161-A1 · Dec 12, 2019 · US
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
US-2019375053-A1 · Dec 12, 2019 · US
Core material, semiconductor package, and forming method of bump electrode
US-10381319-B2 · Aug 13, 2019 · US
Method of manufacturing cu core ball
US-10370771-B2 · Aug 6, 2019 · US
Cu core ball, solder paste, formed solder, Cu core column, and solder joint
US-10322472-B2 · Jun 18, 2019 · US
Solder material, solder joint, and method of manufacturing the solder material
US-10173287-B2 · Jan 8, 2019 · US
Method for producing metal ball, joining material, and metal ball
US-10150185-B2 · Dec 11, 2018 · US
Cu core ball
US-10147695-B2 · Dec 4, 2018 · US
Flux
US-2018339375-A1 · Nov 29, 2018 · US
Cu ball, Cu core ball, solder joint, solder paste, and solder foam
US-10137535-B2 · Nov 27, 2018 · US
Core Material, Semiconductor Package, and Forming Method of Bump Electrode
US-2018174991-A1 · Jun 21, 2018 · US
Joining Member, Solder Material, Solder Paste, Formed Solder, Flux Coated Material, and Solder Joint
US-2018015572-A1 · Jan 18, 2018 · US
Solder Material, Solder Paste, Solder Preform, Solder Joint and Method of Managing the Solder Material
US-2017312860-A1 · Nov 2, 2017 · US
Ni ball, Ni core ball, solder joint, solder paste, and solder foam
US-9802251-B2 · Oct 31, 2017 · US
Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via
US-2017287862-A1 · Oct 5, 2017 · US
Solder Material, Solder Joint, and Method of Manufacturing the Solder Material
US-2017252871-A1 · Sep 7, 2017 · US
Cu Ball, Cu Core Ball, Solder Joint, Solder Paste, and Solder Foam
US-2017246711-A1 · Aug 31, 2017 · US
Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT
US-2017233884-A1 · Aug 17, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Senju Metal Industry Co | 41 |
| Senju Metal Lndustry Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C22C9/00 | 27 |
| B23K35/262 | 27 |
| B23K35/302 | 25 |
| B23K35/0244 | 23 |
| C22C13/00 | 23 |