Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device
US-2024238914-A1 · Jul 18, 2024 · US
Alloys based on tin
Alloys based on tin · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C22C13/00 |
| Official title | Alloys based on tin |
| Display label | Alloys based on tin |
| Total patents | 839 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 78 |
| 2016 | 95 |
| 2017 | 93 |
| 2018 | 70 |
| 2019 | 87 |
| 2020 | 86 |
| 2021 | 77 |
| 2022 | 68 |
| 2023 | 69 |
| 2024 | 61 |
| 2025 | 45 |
| 2026 | 10 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Solder alloy, solder paste, and electronic circuit board
US-9221132-B2 · Dec 29, 2015 · US
Solder alloy, solder paste, and electronic circuit board
US-9221129-B2 · Dec 29, 2015 · US
Aluminum-tin paste and its use in manufacturing solderable electrical conductors
US-2015364615-A1 · Dec 17, 2015 · US
Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part
US-9209527-B2 · Dec 8, 2015 · US
Flux and solder paste
US-2015343571-A1 · Dec 3, 2015 · US
Solder material and bonded structure
US-9199340-B2 · Dec 1, 2015 · US
Bonded body and semiconductor module
US-9196563-B2 · Nov 24, 2015 · US
Lead-free solder alloy for printed circuit board assemblies for high-temperature environments
US-2015328723-A1 · Nov 19, 2015 · US
Lead-free solder alloy
US-2015328722-A1 · Nov 19, 2015 · US
Intermetallic nanoparticles
US-9187806-B2 · Nov 17, 2015 · US
Power module
US-2015319876-A1 · Nov 5, 2015 · US
Power module
US-2015319877-A1 · Nov 5, 2015 · US
MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability
US-9175368-B2 · Nov 3, 2015 · US
Method for Producing An Electrical Contact Element For Preventing Tin Whisker Formation, and Contact Element
US-2015310956-A1 · Oct 29, 2015 · US
Negative electrode for electric device and electric device using the same
US-2015311500-A1 · Oct 29, 2015 · US
Negative electrode for electric device and electric device using the same
US-2015303451-A1 · Oct 22, 2015 · US
Solder alloy, solder paste, and electronic circuit board
US-2015305167-A1 · Oct 22, 2015 · US
Lead-free solder alloy for printed circuit board assemblies for high-temperature environments
US-9167704-B2 · Oct 20, 2015 · US
Lead-free jointing material and method of producing the same
US-9157135-B2 · Oct 13, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C22C13/00?
- CPC C22C13/00 is the Cooperative Patent Classification code for “Alloys based on tin.”
- How many patents are filed under CPC C22C13/00 (Alloys based on tin)?
- Our database includes 839 publications tagged with this CPC code.
- Is patent activity under CPC C22C13/00 growing?
- Publication counts under this code: 61 in 2024 vs 45 in 2025 (latest complete years).