Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
US-2019375053-A1 · Dec 12, 2019 · US
Cu core ball, solder joint, solder paste and formed solder
US10639749B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10639749-B2 |
| Application number | US-201916435776-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 10, 2019 |
| Priority date | Jun 12, 2018 |
| Publication date | May 5, 2020 |
| Grant date | May 5, 2020 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
The Cu core ball contains a Cu ball and one or more metal layer for covering a surface of the Cu ball, each layer including one or more element selected from Ni, Co, Fe and Pd. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% by mass or higher and 99.9995% or lower, sphericity which is 0.95 or higher and a diameter of 1 μm or more to 1000 μm or lower.
First claim
Opening claim text (preview).
What is claimed is: 1. A Cu core ball comprising: a Cu ball, and one or more metal layer for covering a surface of the Cu ball, each layer including one or more element selected from a group of Ni, Co, Fe and Pd, wherein the Cu ball contains at least one element selected from a group of Fe, Ag and Ni in a total amount of 5.0 ppm by mass or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 1.0 ppm by mass, and remainder of Cu and inevitable impurities, wherein the Cu ball contains purity which is 99.995% by mass or higher to 99.9995% by mass or lower, and sphericity which is 0.95 or higher, and wherein the Cu ball contains a diameter of 1 μm or more to 1000 μm or lower. 2. The Cu core ball according to claim 1 wherein the sphericity thereof is 0.98 or higher. 3. The Cu core ball according to claim 1 wherein the sphericity thereof is 0.99 or higher. 4. The Cu core ball according to claim 1 wherein the Cu core ball contains alpha dose which is 0.0200 cph/cm 2 or lower. 5. The Cu core ball according to claim 1 wherein the Cu core ball contains alpha dose which is 0.0010 cph/cm 2 or lower. 6. The Cu core ball according to claim 1 , further containing a solder layer which covers a surface of the metal layer wherein the sphericity of the Cu core ball is 0.95 or higher. 7. The Cu core ball according to claim 6 wherein the sphericity of the Cu core ball is 0.98 or higher. 8. The Cu core ball according to claim 6 wherein the sphericity of the Cu core ball is 0.99 or higher. 9. The Cu core ball according to claim 6 wherein the Cu core ball contains alpha dose which is 0.0200 cph/cm 2 or lower. 10. The Cu core ball according to claim 6 wherein the Cu core ball contains alpha dose which is 0.0010 cph/cm 2 or lower. 11. A solder joint formed from the Cu core ball according to claim 1 . 12. The solder joint according to claim 11 , the Cu core ball further containing a solder layer which covers a surface of the metal layer wherein the sphericity of the Cu core ball is 0.95 or higher. 13. Solder paste comprising the Cu core ball according to claim 1 . 14. The solder paste according to claim 13 , the Cu core ball further containing a solder layer which covers a surface of the metal layer wherein the sphericity of the Cu core ball is 0.95 or higher. 15. Formed solder comprising the Cu core ball according to claim 1 . 16. The formed solder according to claim 15 , the Cu core ball further containing a solder layer which covers a surface of the metal layer wherein the sphericity of the Cu core ball is 0.95 or higher.
Assignees
Inventors
Classifications
Surface feature [e.g., rough, mirror] · CPC title
Co-, Fe-, or Ni-base components, alternative to each other · CPC title
Soldering · CPC title
layered · CPC title
Fe-base has 0.01-1.7% carbon [i.e., steel] · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10639749B2 cover?
- The Cu core ball contains a Cu ball and one or more metal layer for covering a surface of the Cu ball, each layer including one or more element selected from Ni, Co, Fe and Pd. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of…
- Who is the assignee on this patent?
- Senju Metal Industry Co
- What technology area does this patent fall under?
- Primary CPC classification B23K35/025. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue May 05 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).