Ni ball, Ni nuclear ball, solder joint, foam solder and solder paste
US-9816160-B2 · Nov 14, 2017 · US
Method for producing metal ball, joining material, and metal ball
US10150185B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10150185-B2 |
| Application number | US-201415116275-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 4, 2014 |
| Priority date | Feb 4, 2014 |
| Publication date | Dec 11, 2018 |
| Grant date | Dec 11, 2018 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Produced is a metal ball which suppresses an emitted α dose. Contained are the steps of melting a pure metal by heating the pure metal at a temperature which is higher than a boiling point of an impurity to be removed, higher than a melting point of the pure metal, and lower than a boiling point of the pure metal, the pure metal containing a U content of 5 ppb or less, a Th content of 5 ppb or less, purity of 99.9% or more and 99.995% or less, and a Pb or Bi content or a total content of Pb and Bi of 1 ppm or more, and the pure metal having the boiling point higher than the boiling point at atmospheric pressure of the impurity to be removed; and sphering the molten pure metal in a ball.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method of producing a metal ball, characterized in that the method comprises the steps of: melting a pure metal by heating the pure metal at a heating temperature which is set to be higher than a boiling point of Po to be removed, higher than a melting point of the pure metal, and lower than a boiling point of the pure metal, according to the boiling points and melting point changing depending on the atmosphere, the pure metal containing a U content of 5 ppb or less, a Th content of 5 ppb or less, purity of 99.9% or more and 99.995% or less, and a Pb content of 10 ppm or more and less than 50 ppm, and the pure metal having the boiling point at atmospheric pressure higher than the boiling point at atmospheric pressure of the Po to be removed among impurities contained in the pure metal; and sphering the molten pure metal into a ball, wherein the ball has a diameter of from 1 to 1000 pm. 2. The method of producing the metal ball according to claim 1 , wherein the melting point of the pure metal at the atmospheric pressure is 900 degrees C. or higher and the boiling point thereof is 962 degrees C. or higher. 3. The method of producing the metal ball according to claim 1 , further comprising an annealing step of annealing the sphered metal ball. 4. A joining material comprising: the metal ball produced by the method according to claim 1 . 5. A metal ball produced by the method according to claim 1 , wherein the metal ball has an α dose of 0.0200 cph/cm 2 or less and sphericity of 0.90 or more. 6. A joining material comprising: the metal ball of claim 5 . 7. The method of producing the metal ball according to claim 2 , further comprising an annealing step of annealing the sphered metal ball. 8. A joining material comprising: the metal ball produced by the method according to claim 2 . 9. A joining material comprising: the metal ball produced by the method according to claim 3 . 10. A joining material comprising: the metal ball produced by the method according to claim 7 . 11. A metal ball produced by the method according to claim 2 , wherein the metal ball has an α dose of 0.0200 cph/cm 2 or less and sphericity of 0.90 or more. 12. A metal ball produced by the method according to claim 3 , wherein the metal ball has an α dose of 0.0200 cph/cm 2 or less and sphericity of 0.90 or more. 13. A metal ball produced by the method according to claim 7 , wherein the metal ball has an α dose of 0.0200 cph/cm 2 or less and sphericity of 0.90 or more. 14. A joining material comprising: the metal ball of claim 11 . 15. A joining material comprising: the metal ball of claim 12 . 16. A joining material comprising: the metal ball of claim 13 .
Assignees
Inventors
Classifications
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between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
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of outermost layers of multilayered bumps, e.g. material of a coating · CPC title
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- What does patent US10150185B2 cover?
- Produced is a metal ball which suppresses an emitted α dose. Contained are the steps of melting a pure metal by heating the pure metal at a temperature which is higher than a boiling point of an impurity to be removed, higher than a melting point of the pure metal, and lower than a boiling point of the pure metal, the pure metal containing a U content of 5 ppb or less, a Th content of 5 ppb or …
- Who is the assignee on this patent?
- Senju Metal Industry Co
- What technology area does this patent fall under?
- Primary CPC classification B22F9/08. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Dec 11 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).