Cu column, Cu core column, solder joint, and through-silicon via

Patent metadata

Field	Value
Publication number	US-10811376-B2
Application number	US-201415509333-A
Country	US
Kind code	B2
Filing date	Sep 9, 2014
Priority date	Sep 9, 2014
Publication date	Oct 20, 2020
Grant date	Oct 20, 2020

Abstract

Provided are a Cu column, a Cu core column, a solder joint, and a through-silicon via, which have the low Vickers hardness and the small arithmetic mean roughness. For the Cu column 1 according to the present invention, its purity is equal to or higher than 99.9% and equal to or lower than 99.995%, its arithmetic mean roughness is equal to or less than 0.3 μm, and its Vickers hardness is equal to or higher than 20 HV and equal to or less than 60 HV. Since the Cu column 1 is not melted at a melting temperature in the soldering and a definite stand-off height (a space between the substrates) can be maintained, it is preferably applied to the three dimensional mounting or the pitch narrowing mounting.

First claim

The invention claimed is:

1. A Cu column containing:
a top surface, a bottom surface, and a cylindrical peripheral surface extending between the top surface and the bottom surface,
purity which is equal to or higher than 99.9% and equal to or lower than 99.995%,
arithmetic mean roughness which is equal to or less than 0.3 μm, and
Vickers hardness which is equal to or higher than 20 HV and equal to or less than 60 HV,
wherein a diameter of the top surface is 1-300 μm, a diameter of the bottom surface is 1-300 μm, and a height of the cylindrical peripheral surface is 1-3000 μm, and
wherein the arithmetic mean roughness is equal to or less than 0.3 μm across the cylindrical peripheral surface of said Cu column.

2. The Cu column according to claim 1 , wherein an alpha dose is equal to or less than 0.0200 cph/cm 2 .

3. The Cu column according to claim 1 , wherein the Cu column is coated with a flux layer.

4. The Cu column according to claim 1 , wherein the Cu column is coated with an organic film containing an imidazole compound.

5. A Cu core column, containing:
the Cu column according to claim 1 ; and
a solder layer which coats the Cu column.

6. A Cu core column containing:
the Cu column according to claim 1 ; and
a plating layer which includes at least one element selected from a group of Ni, Fe and Co, the plating layer coating the Cu column.

7. The Cu core column according to claim 6 , further comprising:
a solder layer which coats the plating layer.

8. The Cu core column according to claim 5 , wherein an alpha dose is equal to or less than 0.0200 cph/cm 2 .

9. The Cu core column according to claim 5 , wherein the Cu core column is coated with a flux layer.

10. A solder joint using the Cu column according to claim 1 .

11. A through-silicon via using the Cu column according to claim 1 .

12. A solder joint using the Cu core column according to claim 5 .

13. A through-silicon via using the Cu core column according to claim 5 .

14. The Cu column according to claim 2 , wherein the Cu column is coated with a flux layer.

15. The Cu column according to claim 2 , wherein the Cu column is coated with an organic film containing an imidazole compound.

16. A Cu core column, containing:
the Cu column according to claim 2 ; and
a solder layer which coats the Cu column.

17. The Cu column according to claim 1 , wherein said diameter of the top surface is 1-200 μm and said diameter of the bottom surface of 1-200 μm.

18. The Cu column according to claim 1 , wherein said diameter of the top surface is 1-100 μm, said diameter of the bottom surface is 1-100 μm, and said height is 1-100 μm.

19. The Cu column according to claim 1 , wherein the arithmetic mean roughness is equal to or less than 0.2 μm across the entire outermost surface of said Cu column.

Assignees

• Senju Metal Industry Co

Inventors

• Kawasaki Hiroyoshi
• Roppongi Takahiro
• Soma Daisuke
• Sato Isamu
• Kawamata Yuji

Classifications

• H10W20/0261

  characterised by the filling method or the material of the conductive fill · CPC title

• B22F1/00

  Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties · CPC title

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10W72/01215

  forming coatings · CPC title

• H10W72/255

  of outermost layers of multilayered bumps, e.g. material of a coating · CPC title