Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via

Patent metadata

Field	Value
Publication number	US-2017287862-A1
Application number	US-201415509333-A
Country	US
Kind code	A1
Filing date	Sep 9, 2014
Priority date	Sep 9, 2014
Publication date	Oct 5, 2017
Grant date	—

Abstract

Provided are a Cu column, a Cu core column, a solder joint, and a through-silicon via, which have the low Vickers hardness and the small arithmetic mean roughness. For the Cu column 1 according to the present invention, its purity is equal to or higher than 99.9% and equal to or lower than 99.995%, its arithmetic mean roughness is equal to or less than 0.3 μm, and its Vickers hardness is equal to or higher than 20 HV and equal to or less than 60 HV. Since the Cu column 1 is not melted at a melting temperature in the soldering and a definite stand-off height (a space between the substrates) can be maintained, it is preferably applied to the three dimensional mounting or the pitch narrowing mounting.

First claim

1 . A Cu column containing:
purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, arithmetic mean roughness which is equal to or less than 0.3 μm, and Vickers hardness which is equal to or higher than 20 HV and equal to or less than 60 HV.

2 . The Cu column according to claim 1 , wherein an alpha dose is equal to or less than 0.0200 cph/cm 2 .

3 . The Cu column according to claim 1 , wherein said Cu column is composed of a column which has a diameter of the top surface of 1-1000 m, a diameter of the bottom surface of 1-1000 μm, and a height of 1-3000 μm.

4 . The Cu column according to claim 1 , wherein the Cu column is coated with a flux layer.

5 . The Cu column according to claim 1 , wherein the Cu column is coated with an organic film containing an imidazole compound.

6 . A Cu core column, containing:
the Cu column according to claim 1 ; and a solder layer which coats the Cu column.

7 . A Cu core column containing:
the Cu column according to claim 1 ; and a plating layer which includes at least one element selected from a group of Ni, Fe and Co, the plating layer coating the Cu column.

8 . The Cu core column according to claim 7 , further comprising:
a solder layer which coats the plating layer.

9 . The Cu core column according to claim 6 , wherein an alpha dose is equal to or less than 0.0200 cph/cm 2 .

10 . The Cu core column according to claim 6 , wherein the Cu core column is coated with a flux layer.

11 . A solder joint using the Cu column according to claim 1 .

12 . A through-silicon via using the Cu column according to claim 1 .

13 . A solder joint using the Cu core column according to claim 6 .

14 . A through-silicon via using the Cu core column according to claim 6 .

15 . The Cu column according to claim 2 , wherein said Cu column is composed of a column which has a diameter of the top surface of 1-1000 μm, a diameter of the bottom surface of 1-1000 μm, and a height of 1-3000 μm.

16 . The Cu column according to claim 2 , wherein the Cu column is coated with a flux layer.

17 . The Cu column according to claim 3 , wherein the Cu column is coated with a flux layer.

18 . The Cu column according to claim 2 , wherein the Cu column is coated with an organic film containing an imidazole compound.

19 . The Cu column according to claim 3 , wherein the Cu column is coated with an organic film containing an imidazole compound.

20 . A Cu core column, containing:
the Cu column according to claim 2 ; and a solder layer which coats the Cu column.

Assignees

• Senju Metal Industry Co

Inventors

• Kawasaki Hiroyoshi
• Roppongi Takahiro
• Soma Daisuke
• Sato Isamu
• Kawamata Yuji

Classifications

• H10W20/0261

  characterised by the filling method or the material of the conductive fill · CPC title

• H05K3/4015

  using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres · CPC title

• C22C13/00

  Alloys based on tin · CPC title

• B32B15/01

  all layers being exclusively metallic {(making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00)} · CPC title

• B23K35/302

  Cu as the principal constituent · CPC title