Solder material, solder paste, and solder joint

Patent metadata

Field	Value
Publication number	US-11344976-B2
Application number	US-201816766259-A
Country	US
Kind code	B2
Filing date	Nov 21, 2018
Priority date	Nov 24, 2017
Publication date	May 31, 2022
Grant date	May 31, 2022

Abstract

The present invention provides a solder material containing Sn or a Sn-containing alloy and 40 to 320 ppm by mass of A, the solder material including an As-enriched layer.

First claim

The invention claimed is:

1. A solder powder or solder ball comprising Sn or a Sn-containing alloy and 40 to 320 ppm by mass of As, the solder powder or solder ball including an As-enriched layer that is present at least in part on a surface side of the solder powder or solder ball.

2. The solder powder or solder ball according to claim 1 , further comprising 20 ppm by mass to 3% by mass of Bi.

3. The solder powder or solder ball according to claim 1 , further comprising 20 ppm by mass to 0.5% by mass of Sb.

4. The solder powder or solder ball according to claim 1 , further comprising 20 ppm by mass to 0.7% by mass of Pb.

5. The solder powder or solder ball according to claim 1 , further comprising 0 to 3000 ppm by mass of Sb, 0 to 10000 ppm by mass of Bi, and 0 to 5100 ppm by mass of Pb, wherein contents of Bi and Pb are not simultaneously 0 ppm by mass.

6. The solder powder or solder ball according to claim 5 , wherein contents of As, Sb, Bi and Pb satisfy the following formulas (1) and (2):
275≤2As+Sb+Bi+Pb  (1)

0.01≤(2As+Sb)/(Bi+Pb)≤10.00  (2)

wherein As, Sb, Bi and Pb in the formulas (1) and (2) respectively represent contents (in ppm by mass) of As, Sb, Bi and Pb in the solder powder or solder ball.

7. The solder powder or solder ball according to claim 1 , wherein the Sn-containing alloy contains 0.005 to 40% by mass of Ag and/or 0.001 to 10% by mass of Cu.

8. The solder powder or solder ball according to claim 1 , wherein the Sn-containing alloy contains 0 to 4% by mass of Ag, 0 to 1% by mass of Cu, 0 to 52% by mass of In, 0 to 0.15% by mass of Ni, 0 to 0.015% by mass of Co, and a balance of Sn.

9. The solder powder or solder ball according to claim 1 , wherein the solder powder or solder ball is in the form of a powder.

10. A solder paste comprising the solder powder according to claim 9 and a flux.

11. The solder paste according to claim 10 , further comprising a zirconium oxide powder.

12. The solder paste according to claim 11 , wherein a content of the zirconium oxide powder is 0.05 to 20.0% by mass with respect to a total mass of the solder paste.

13. The solder powder or solder ball according to claim 1 , formed into a solder joint.

14. The solder powder or solder ball according to claim 7 , wherein the solder powder or solder ball is in the form of a powder.

15. A solder paste comprising the solder powder according to claim 14 and a flux.

16. The solder powder or solder ball according to claim 8 , wherein the solder powder or solder ball is in the form of a powder.

17. A solder paste comprising the solder powder according to claim 16 and a flux.

18. The solder powder or solder ball according to claim 7 , formed into a solder joint.

19. The solder powder or solder ball according to claim 8 , formed into a solder joint.

Assignees

• Senju Metal Industry Co

Inventors

• Kawasaki Hiroyoshi
• Sudo Hiroki
• Roppongi Takahiro
• Okada Hiroshi
• Soma Daisuke
• AKAGAWA Takashi
• Takahashi Hiroshi
• Kawanago Hiroshi
• Yokota Satoshi
• Munekata Osamu

Classifications

• H05K3/3465

  Application of solder · CPC title

• Y10T428/12708

  Sn-base component · CPC title

• C22C13/02

  with antimony or bismuth as the next major constituent · CPC title

• C22C28/00

  Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00 · CPC title

• B23K35/26

  with the principal constituent melting at less than 400°C · CPC title