Cu ball, Osp-treated Cu ball, Cu core ball, solder joint, solder paste, formed solder, and method for manufacturing Cu ball

Patent metadata

Field	Value
Publication number	US-11185950-B2
Application number	US-201816769426-A
Country	US
Kind code	B2
Filing date	Dec 4, 2018
Priority date	Dec 6, 2017
Publication date	Nov 30, 2021
Grant date	Nov 30, 2021

Abstract

Provided are a Cu ball, an OSP-treated Cu ball, a Cu core ball, a solder joint, solder paste, and formed solder, which realize high sphericity and low hardness and in which discoloration is suppressed. An electronic component is configured by joining a solder bump of a semiconductor chip and an electrode of a printed circuit board with solder pastes The solder bump formed by joining a Cu ball to an electrode of the semiconductor chip. The Cu ball has a purity of 99.995% by mass or more and 99.9995% by mass or less, a total content of at least one element selected from Fe, Ag, and Ni of 5.0 ppm by mass or more and 50.0 ppm by mass or less, a content of S of 1.0 ppm by mass or less, and a content of P of less than 3.0 ppm by mass.

First claim

The invention claimed is:

1. A Cu ball, comprising:
a purity of more than 99.995% by mass and 99.9995% by mass or less;
a total content of at least one element selected from Fe, Ag, and Ni of 5.0 ppm by mass or more and 50.0 ppm by mass or less;
a content of S of 0 ppm by mass or more and 1.0 ppm by mass or less; and
a content of P of 0 ppm by mass or more and less than 3.0 ppm by mass,
wherein the sphericity is 0.98 or more,
wherein the Vickers hardness is 55 HV or less, and
wherein the α dose is 0.0200 cph/cm 2 or less.

2. The Cu ball according to claim 1 , wherein the content of P is 0 ppm by mass or more and less than 1.0 ppm by mass.

3. The Cu ball according to claim 1 , wherein the α dose is 0.0100 cph/cm 2 or less.

4. The Cu ball according to claim 1 , wherein the sphericity is 0.99 or more.

5. The Cu ball according to claim 1 , wherein the Cu ball is monolayer-or multilayer-plated with at least any one of Ni, Fe, Co, Pd, Ag, and Cu.

6. A Cu core ball, comprising:
the Cu ball according to claim 1 ; and
a solder layer coating the Cu ball.

7. A Cu core ball, comprising:
the Cu ball according to claim 1 , wherein the Cu ball is monolayer- or multilayer-plated with at least any one of Ni, Fe, Co, Pd, Ag, and Cu; and
a solder layer coating the Cu ball.

8. The Cu core ball according to claim 7 , wherein the α dose is 0.0100 cph/cm 2 or less.

9. The Cu core ball according to claim 7 , wherein the sphericity is 0.99 or more.

Assignees

• Senju Metal Industry Co

Inventors

• Kawasaki Hiroyoshi
• Soma Daisuke

Classifications

• H10W72/012

  of bump connectors, dummy bumps or thermal bumps · CPC title

• B22F1/102

  Metallic powder coated with organic material · CPC title

• B22F1/065 Primary

  Spherical particles · CPC title

• B22F1/17

  Metallic particles coated with metal · CPC title

• B22F1/00

  Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties · CPC title