Cu core ball, solder joint, solder paste and formed solder

Patent metadata

Field	Value
Publication number	US-10888959-B2
Application number	US-201916435818-A
Country	US
Kind code	B2
Filing date	Jun 10, 2019
Priority date	Jun 12, 2018
Publication date	Jan 12, 2021
Grant date	Jan 12, 2021

Abstract

The Cu core ball contains a Cu ball and a solder layer for covering a surface of the Cu ball. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 or more to 1.0 ppm by mass or lower, P in an amount of 0 or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% or higher and 99.9995% by mass or lower, and sphericity which is 0.95 or higher. The solder layer includes Ag in an amount of more than 0 to 4.0% by mass or less, Cu in an amount of more than 0 to 3.0% by mass or less, and remainder of Sn.

First claim

What is claimed is:

1. A Cu core ball comprising:
a Cu ball, and
a solder layer for covering a surface of the Cu ball,
wherein the Cu ball contains at least one element selected from a group of Fe, Ag and Ni in a total amount of 5.0 ppm by mass or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities,
wherein the Cu ball contains purity which is 99.995% by mass or higher to 99.9995% by mass or lower, and sphericity which is 0.95 or higher, and
wherein the solder layer includes Ag in an amount of more than 0% by mass to 4.0% by mass or less, Cu in an amount of more than 0% by mass to 3.0% by mass or less, and remainder of Sn.

2. The Cu core ball according to claim 1 wherein the solder layer includes Ag in an amount of 0.1% by mass or more to 2.0% by mass or less.

3. The Cu core ball according to claim 1 wherein the solder layer includes Cu in an amount of 0.1% by mass or more to 1.0% by mass or less.

4. The Cu core ball according to claim 1 wherein the sphericity thereof is 0.98 or higher.

5. The Cu core ball according to claim 1 wherein the sphericity thereof is 0.99 or higher.

6. The Cu core ball according to claim 1 wherein the Cu core ball contains alpha dose which is 0.0200 cph/cm 2 or lower.

7. The Cu core ball according to claim 1 wherein the Cu core ball contains alpha dose which is 0.0010 cph/cm 2 or lower.

8. The Cu core ball according to claim 1 , further containing a metal layer which covers a surface of the Cu ball wherein the solder layer covers a surface of the metal layer and the sphericity of the Cu core ball is 0.95 or higher.

9. The Cu core ball according to claim 8 wherein the sphericity thereof is 0.98 or higher.

10. The Cu core ball according to claim 8 wherein the sphericity thereof is 0.99 or higher.

11. The Cu core ball according to claim 8 wherein the Cu core ball contains alpha dose which is 0.0200 cph/cm 2 or lower.

12. The Cu core ball according to claim 8 wherein the Cu core ball contains alpha dose which is 0.0010 cph/cm 2 or lower.

13. The Cu core ball according to claim 8 wherein the Cu ball contains a diameter which is within a range of 1 μm or more and 1000 μm or less.

14. The Cu core ball according to claim 1 wherein the Cu ball contains a diameter which is within a range of 1 μm or more and 1000 μm or less.

15. A solder joint using the Cu core ball according to claim 1 .

16. The solder joint according to claim 15 , the Cu core ball further containing a metal layer which covers a surface of the Cu ball, wherein the solder layer covers a surface of the metal layer and the sphericity of the Cu core ball is 0.95 or higher.

17. Solder paste using the Cu core ball according to claim 1 .

18. The solder paste according to claim 17 , the Cu core ball further containing a metal layer which covers a surface of the Cu ball, wherein the solder layer covers a surface of the metal layer and the sphericity of the Cu core ball is 0.95 or higher.

19. Formed solder using the Cu core ball according to claim 1 .

20. The formed solder according to claim 19 , the Cu core ball further containing a metal layer which covers a surface of the Cu ball, wherein the solder layer covers a surface of the metal layer and the sphericity of the Cu core ball is 0.95 or higher.

Assignees

• Senju Metal Industry Co

Inventors

• Kawasaki Hiroyoshi
• KONDOH Shigeki
• Sudo Hiroki
• Tsuchiya Masato
• Yashima Takashi
• Roppongi Takahiro
• Soma Daisuke

Classifications

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/07251

  characterised by changes in properties of the bump connectors during connecting · CPC title

• B22F1/06

  Metallic powder characterised by the shape of the particles (nanosized particles B22F1/054) · CPC title

• B22F1/17

  Metallic particles coated with metal · CPC title

• B22F1/065

  Spherical particles · CPC title