Lead-Free Solder, Lead-Free Solder Ball, Solder Joint Using the Lead-Free Solder and Semiconductor Circuit Having the Solder Joint
US-2016214212-A1 · Jul 28, 2016 · US
Solder material, solder paste, formed solder and solder joint
US2020061757A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020061757-A1 |
| Application number | US-201816487388-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 28, 2018 |
| Priority date | Feb 28, 2017 |
| Publication date | Feb 27, 2020 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
A solder material capable of suppressing the occurrence of electromigration is provided. The solder material is core ball 1 A which comprises spherical core 2 A composed of Cu or a Cu alloy, and solder layer 3 A coating core 2 A, and wherein solder layer 3 A has: a Cu content of 0.1 mass % or more and 3.0 mass % or less, a Bi content of 0.5 mass % or more and 5.0 mass % or less, a Ag content of 0 mass % or more and 4.5 mass % or less, and a Ni content of 0 mass % or more and 0.1 mass % or less, with Sn being the balance.
First claim
Opening claim text (preview).
1 . A solder material comprising: a core of a metal and, a solder layer coating the core, wherein the solder layer has: a Cu content of 0.1 mass % or more and 3.0 mass % or less, a Bi content of 0.5 mass % or more and 5.0 mass % or less, a Ag content of 0 mass % or more and 4.5 mass % or less, and a Ni content of 0 mass % or more and 0.1 mass % or less, with Sn being the balance. 2 . The solder material according to claim 1 , wherein the solder layer has the Bi content of more than 1.0 mass % and 5.0 mass % or less, and contains no Ag. 3 . The solder material according to claim 1 , wherein the Ag content is more than 1.5 mass % and 4.5 mass % or less. 4 . The solder material according to claim 1 , wherein the core is a metal of Cu, Ni, Ag, Au, Al, Mo, Mg, Zn, or Co, or an alloy of any combination of the metal. 5 . The solder material according to claim 1 , wherein the core is a spherical core ball. 6 . The solder material according to claim 1 , wherein the core is a columnar core column. 7 . The solder material according to claim 1 , wherein the core coated with a layer consisting of one or more elements selected from Ni and Co is coated with the solder layer. 8 . A solder paste using the solder material according to claim 1 . 9 . A formed solder using the solder material according to claim 1 . 10 . A solder joint using the solder material according to claim 1 . 11 . The solder material according to claim 1 , wherein the core is a spherical core ball and wherein the core coated with a layer consisting of one or more elements selected from Ni and Co is coated with the solder layer. 12 . The solder material according to claim 1 , wherein the core is a columnar core column and wherein the core coated with a layer consisting of one or more elements selected from Ni and Co is coated with the solder layer. 13 . A solder joint using the solder material according to claim 1 , wherein the core coated with a layer consisting of one or more elements selected from Ni and Co is coated with the solder layer.
Assignees
Inventors
Classifications
mainly consisting of metals or alloys · CPC title
- B23K35/262Primary
Sn as the principal constituent · CPC title
Alloys based on tin · CPC title
Low melting point metals, i.e. Zn, Pb, Sn, Cd, In, Ga · CPC title
Copper · CPC title
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Frequently asked questions
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- What does patent US2020061757A1 cover?
- A solder material capable of suppressing the occurrence of electromigration is provided. The solder material is core ball 1 A which comprises spherical core 2 A composed of Cu or a Cu alloy, and solder layer 3 A coating core 2 A, and wherein solder layer 3 A has: a Cu content of 0.1 mass % or more and 3.0 mass % or less, a Bi content of 0.5 mass % or more and 5.0 mass % o…
- Who is the assignee on this patent?
- Senju Metal Industry Co
- What technology area does this patent fall under?
- Primary CPC classification B23K35/262. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Feb 27 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).