Cu core ball

Patent metadata

Field	Value
Publication number	US-10147695-B2
Application number	US-201314899378-A
Country	US
Kind code	B2
Filing date	Jun 19, 2013
Priority date	Jun 19, 2013
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

A Cu core ball is provided that prevents any soft errors and decreases any connection failure. The Cu core ball includes a solder plating film formed on the surface of a Cu ball that is a Sn solder plating film or is made of a lead-free solder alloy, a principal ingredient of which is Sn. The solder plating film contains U of 5 ppb or less and Th of 5 ppb or less. The Cu ball has a purity of not less than 99.9% Cu and not more than 99.995% Cu. Pb and/or Bi contents therein are at a total of 1 ppm or more. The sphericity thereof is 0.95 or more. The obtained Cu core ball has an α dose of 0.0200 cph/cm 2 or less.

First claim

The invention claimed is:

1. A Cu core ball containing a Cu ball and a solder plating film that coats a surface of the Cu ball, wherein the solder plating film comprises a Sn solder plating film or a solder plating film which is made of lead-free solder alloy, a principal ingredient of the lead-free solder alloy being Sn;
the solder plating film contains U content of 5 ppb or less and Th content of 5 ppb or less;
the Cu ball includes purity of not less than 99.9% Cu and not more than 99.995% Cu; Pb and/or Bi at a total of 1 ppm or more; and a dose of the Cu core ball is 0.0200 cph/cm 2 or less,
wherein the sphericity of the Cu core ball is 0.95 or more, and
wherein the solder plating film has a thickness of 20-100 μm.

2. The Cu core ball according to claim 1 wherein the α dose of the Cu core ball is 0.0020 cph/cm 2 or less.

3. The Cu core ball according to claim 1 wherein the α dose of the Cu core ball is 0.0010 cph/cm 2 or less.

4. The Cu core ball according to claim 1 wherein the Cu core ball comprises both Pb and Bi at a total of 1 ppm or more.

5. The Cu core ball according to claim 1 having a diameter of 1 μm through 1000 μm.

6. The Cu core ball according to claim 1 wherein the Cu ball is coated by a plating layer which is made of one element or more previously selected from a group consisting of Ni and Co before the Cu ball is coated by the solder plating film.

7. A solder joint that is formed using the Cu core ball according to claim 1 .

8. The Cu core ball according to claim 1 wherein the Cu ball comprises Pb at a total of 1 ppm or more.

Assignees

• Senju Metal Industry Co

Inventors

• Kawasaki Hiroyoshi
• Hashimoto Tomohiko
• Ikeda Atsushi
• Roppongi Takahiro
• Soma Daisuke
• Sato Isamu
• Kawamata Yuji

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W72/255

  of outermost layers of multilayered bumps, e.g. material of a coating · CPC title

• H10W72/225

  Bumps having a filler embedded in a matrix · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title