Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint

Patent metadata

Field	Value
Publication number	US-10675719-B2
Application number	US-201515539323-A
Country	US
Kind code	B2
Filing date	Dec 24, 2015
Priority date	Dec 26, 2014
Publication date	Jun 9, 2020
Grant date	Jun 9, 2020

Abstract

Provided herein is a solder material that includes a spherical core that provides space between a joint object and another object to be joined to the joint object and a solder coated layer that has a melting point at which a core layer of the core is not melted. The solder coated layer includes Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core. The solder coated layer has an average grain diameter of crystal grains of 3 μm or less, and the solder material has a spherical diameter of 1 to 230 μm and a sphericity of 0.95 or more.

First claim

The invention claimed is:

1. A solder material characterized in that the solder material comprises:
a spherical core that provides space between a joint object and another object to be joined to the joint object; and
a solder coated layer that has a melting point at which a core layer of the core is not melted, contains Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core, wherein
the solder coated layer has an average grain diameter of crystal grains of 3 μm or less,
the solder material has a spherical diameter of 1 to 230 μm and a sphericity of 0.95 or more, and
the solder coated layer contains a brightener.

2. The solder material according to claim 1 , wherein the core is a spherical material made of an elemental metal, an alloy, a metal oxide, or a mixed metal oxide of Cu, Ni, Ag, Bi, Pb, Al, Sn, Fe, Zn, In, Ge, Sb, Co, Mn, Au, Si, Pt, Cr, La, Mo, Nb, Pd, Ti, Zr, or Mg, or a resin.

3. The solder material according to claim 1 , wherein the solder coated layer contains at least one selected from a group consisting of Cu, Bi, In, Zn, Ni, Co, Fe, Pb, P, Ge, Ga, and Sb as an additive element.

4. The solder material according to claim 1 , wherein a dose is 0.0200 cph/cm2 or less.

5. A method of manufacturing a solder material wherein the method comprises:
manufacturing the solder material having a spherical diameter of 1 to 230 μm and a sphericity of 0.95 or more by coating on a spherical core that provides space between a joint object and another object to be joined to the joint object, a solder coated layer that has a melting point at which a core layer of the core is not melted, and adding brightener to plating solution for forming the solder coated layer, wherein the solder coated layer contains Sn as a main ingredient and 0 to 2 mass % of Ag, wherein the solder coated layer has a grain diameter of crystal grains of 3 μm or less, and wherein the solder coated layer contains a brightener.

6. A solder paste wherein the solder paste comprises the solder material according to claim 1 .

7. A formed solder wherein the formed solder comprises the solder material according to claim 1 .

8. A flux coated material wherein the flux coated material comprises the solder material according to claim 1 .

9. A solder joint wherein the solder joint comprises the solder material according to claim 1 .

Assignees

• Senju Metal Industry Co

Inventors

• Kawasaki Hiroyoshi
• Kondo Shigeki
• Ikeda Atsushi
• Roppongi Takahiro
• Hagiwara Takashi
• Soma Daisuke
• Tsuruta Kaichi
• Sato Isamu
• Kawamata Yuji

Classifications

• B22F1/025

  Operations & Transport · mapped topic

• B23K35/22

  characterised by the composition or nature of the material · CPC title

• C25D3/60

  containing more than 50% by weight of tin · CPC title

• C25D3/18

  Heterocyclic compounds · CPC title

• B23K35/3033

  Ni as the principal constituent · CPC title