Integration method of vertical dram with periphery circuit
US-2026047070-A1 · Feb 12, 2026 · US
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Sitaram Arkalgud R patents
Sitaram Arkalgud R is listed as an inventor on 107 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sitaram Arkalgud R |
| Total patents | 107 |
| First publication | Sep 17, 2015 |
| Latest publication | Feb 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Capacitive coupling in a direct-bonded interface for microelectronic devices
US-2026018564-A1 · Jan 15, 2026 · US
Sealed bonded structures and methods for forming the same
US-2025349773-A1 · Nov 13, 2025 · US
Bonded structure including an obstructive element directly bonded to a semiconductor element without an adhesive
US-12451439-B2 · Oct 21, 2025 · US
Stacked dies and methods for forming bonded structures
US-2025266416-A1 · Aug 21, 2025 · US
Sealed bonded structures and methods for forming the same
US-12374641-B2 · Jul 29, 2025 · US
Capacitive coupling in a direct-bonded interface for microelectronic devices
US-12272673-B2 · Apr 8, 2025 · US
Stacked dies and methods for forming bonded structures
US-12266650-B2 · Apr 1, 2025 · US
Bonded structures
US-2025079385-A1 · Mar 6, 2025 · US
Stacked dies and methods for forming bonded structures
US-12113056-B2 · Oct 8, 2024 · US
Recent patents
Latest publications not already listed above.
Bonded structures
US-12100684-B2 · Sep 24, 2024 · US
Stacked dies and methods for forming bonded structures
US-2024145458-A1 · May 2, 2024 · US
Stacked dies and methods for forming bonded structures
US-11837596-B2 · Dec 5, 2023 · US
Bonded structures
US-2023361072-A1 · Nov 9, 2023 · US
Protective elements for bonded structures
US-2023317628-A1 · Oct 5, 2023 · US
Bonded structures
US-11670615-B2 · Jun 6, 2023 · US
Stacked dies and methods for forming bonded structures
US-11658173-B2 · May 23, 2023 · US
Stacked dies and methods for forming bonded structures
US-2023131849-A1 · Apr 27, 2023 · US
Stacked dies and methods for forming bonded structures
US-2023130580-A1 · Apr 27, 2023 · US
Integrated interposer solutions for 2D and 3D IC packaging
US-11302616-B2 · Apr 12, 2022 · US
Structures and methods for reliable packages
US-11056390-B2 · Jul 6, 2021 · US
Bonded structures
US-2021202428-A1 · Jul 1, 2021 · US
Stacked dies and methods for forming bonded structures
US-2021183847-A1 · Jun 17, 2021 · US
Capacitive coupling in a direct-bonded interface for microelectronic devices
US-2021035954-A1 · Feb 4, 2021 · US
Bonded structures
US-10879210-B2 · Dec 29, 2020 · US
Bonded structures
US-10879207-B2 · Dec 29, 2020 · US
Stacked dies and methods for forming bonded structures
US-10879226-B2 · Dec 29, 2020 · US
Sealed bonded structures and methods for forming the same
US-2020395321-A1 · Dec 17, 2020 · US
Capacitive coupling in a direct-bonded interface for microelectronic devices
US-10811388-B2 · Oct 20, 2020 · US
Bonded structures
US-2020144217-A1 · May 7, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Invensas Corp | 72 |
| Adeia Semiconductor Bonding Technologies Inc | 16 |
| Invensas Bonding Tech Inc | 16 |
| Adeia Semiconductor Tech Llc | 2 |
| Tokyo Electron Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 64 |
| H10W70/65 | 43 |
| H10W90/724 | 42 |
| H10W80/327 | 41 |
| H01L25/50 | 39 |