Bonded structures

Patent metadata

Field	Value
Publication number	US-10879207-B2
Application number	US-201916724017-A
Country	US
Kind code	B2
Filing date	Dec 20, 2019
Priority date	Dec 21, 2016
Publication date	Dec 29, 2020
Grant date	Dec 29, 2020

Abstract

A bonded structure can include a first element having a first conductive interface feature and a second element having a second conductive interface feature. An integrated device can be coupled to or formed with the first element or the second element. The first conductive interface feature can be directly bonded to the second conductive interface feature to define an interface structure. The interface structure can be disposed about the integrated device in an at least partially annular profile to connect the first and second elements.

First claim

What is claimed is:

1. A bonded structure comprising:
a first semiconductor element including first conductive features and first non-conductive features;
a second semiconductor element including second conductive features and second non-conductive features, the second semiconductor element comprising an integrated device and back-end-of-line interconnect structures,
the first semiconductor element directly bonded to the second semiconductor element such that the first conductive features are directly bonded to corresponding second conductive features without an intervening adhesive layer and the first non-conductive features are directly bonded to corresponding second non-conductive features without an intervening adhesive;
the first and second conductive features including electrical interconnects to provide electrical connection between the first and second semiconductor elements; and

a crack stopper structure extending vertically through the back-end-of-line interconnect structures of the second semiconductor element.

2. The bonded structure of claim 1 , wherein the crack stopper structure is in contact with at least one of the second conductive features.

3. The bonded structure of claim 2 , wherein the first and second conductive features form an effectively closed profile around the integrated device, the effectively closed profile substantially sealing an interior region of the bonded structure including the integrated device from gas diffusion.

4. The bonded structure of claim 3 , wherein the first and second conductive features define a closed shape continuously surrounding the interior region.

5. The bonded structure of claim 1 , wherein the crack stopper structure extends around a perimeter of the second semiconductor element.

6. The bonded structure of claim 1 , wherein the back-end-of-line interconnect structures comprise a low K dielectric material, and wherein the crack stopper structure is formed within the low K dielectric material of the back-end-of-line interconnect structures.

7. The bonded structure of claim 1 , wherein the crack stopper structure comprises separate vertical segments formed of multiple metallization levels and connected to form a continuous vertical feature surrounding a central region of the second semiconductor element.

8. The bonded structure of claim 1 , wherein the first conductive features of the first semiconductor element further comprises a first closed annular conductive feature extending continuously around the integrated device.

9. The bonded structure of claim 8 , wherein the first closed annular conductive feature is directly bonded to a second closed annular conductive feature of the second semiconductor element without an intervening adhesive to form a directly bonded annular conductive feature.

10. The bonded structure of claim 9 , wherein the electrical interconnects are spaced inwardly from the directly bonded annular conductive feature, and wherein the electrical interconnects are electrically separated from the directly bonded annular conductive features.

11. The bonded structure of claim 8 , wherein the first semiconductor element comprises a plurality of first closed annular conductive features extending continuously around the integrated device.

12. A bonded structure comprising:
a first semiconductor element including at least one first conductive feature extending vertically into the first semiconductor element, first non-conductive features, and a first electrical component in an interior region of the bonded structure, the at least one first conductive feature comprising an effectively closed profile around the first electrical component; and
a second semiconductor element including at least one second conductive feature extending vertically into the second semiconductor element, and second non-conductive features, the at least one second conductive feature comprising an effectively closed profile around the first electrical component;
wherein the first semiconductor element is directly bonded to the second semiconductor element such that the at least one first conductive feature is directly bonded to the at least one second conductive feature without an intervening adhesive and the first non-conductive features are directly bonded to corresponding second non-conductive features without an intervening adhesive;
wherein a first electrical interconnect of the first semiconductor element and a second electrical interconnect of the second semiconductor element are directly bonded to one another without an intervening adhesive within the interior region, the first and second electrical interconnects providing electrical connection between the first electrical component and the second semiconductor element.

13. The bonded structure of claim 12 , wherein the second semiconductor element comprises back-end-of-line interconnect structures, the bonded structure further comprising a crack stopper structure extending vertically from the at least one second conductive feature through the back-end-of-line interconnect structures of the second semiconductor element.

14. The bonded structure of claim 13 , wherein the crack stopper structure extends around a perimeter of the second semiconductor element.

15. The bonded structure of claim 14 , wherein the first and second conductive features define a closed shape continuously surrounding the interior region.

16. The bonded structure of claim 12 , wherein the first semiconductor element comprises a first bonding layer including the at least one first conductive feature and the first non-conductive features, and the second semiconductor element comprises a second bonding layer including the at least one second conductive feature and the second non-conductive features.

17. The bonded structure of claim 16 , wherein the first and second bonding layers comprise nitrogen terminations at a bonding interface.

18. The bonded structure of claim 17 , wherein the first and second non-conductive features of the first and second bonding layers comprise silicon oxide, and the at least one first and second conductive features of the first and second bonding layers comprise metal.

19. The bonded structure of claim 12 , wherein the at least one first conductive feature comprises a plurality of laterally spaced apart first conductive feature portions with intervening first non-conductive features, and the at least one second conductive feature comprises a plurality of laterally spaced apart second conductive feature portions with intervening second non-conductive features.

20. The bonded structure of claim 12 , wherein the second semiconductor element comprises a second electrical component in the interior region, and traces connecting the second electrical component with the second electrical interconnect.

21. The bonded structure of claim 12 , wherein the second interconnect comprises a through semiconductor via.

Assignees

• Invensas Bonding Tech Inc

Inventors

• Wang Liang
• Katkar Rajesh
• Delacruz Javier A
• Sitaram Arkalgud R

Classifications

• H10W90/794

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W80/701

  characterised by the pads after the direct bonding · CPC title

• H10W80/327

  characterised by the direct bonding of insulating parts, e.g. of silicon oxide layers · CPC title

• H10W80/312

  characterised by the direct bonding of electrically conductive pads · CPC title

• H10W80/037

  by mechanical treatment, e.g. by cutting, pressing or stamping · CPC title