Antenna package using ball attach array to connect antenna and base substrates
US-12586906-B2 · Mar 24, 2026 · US
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Lambert William J patents
Lambert William J is listed as an inventor on 107 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lambert William J |
| Total patents | 107 |
| First publication | Jun 11, 2015 |
| Latest publication | Mar 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Package architecture for quasi-monolithic chip with backside power
US-12581938-B2 · Mar 17, 2026 · US
Keep out zone with hydrophobic surface for integrated circuit (IC) package
US-12575415-B2 · Mar 10, 2026 · US
In situ inductor structure in buildup power planes
US-12520506-B2 · Jan 6, 2026 · US
Antenna modules and communication devices
US-2025316887-A1 · Oct 9, 2025 · US
Microelectronic assemblies with direct attach to circuit boards
US-2025293170-A1 · Sep 18, 2025 · US
Power delivery through capacitor-dies in a multi-layered microelectronic assembly
US-12406962-B2 · Sep 2, 2025 · US
Antenna package using ball attach array to connect antenna and base substrates
US-2025226583-A1 · Jul 10, 2025 · US
Microelectronic assemblies with direct attach to circuit boards
US-12347782-B2 · Jul 1, 2025 · US
Packaging architecture for disaggregated integrated voltage regulators
US-12308362-B2 · May 20, 2025 · US
Recent patents
Latest publications not already listed above.
Antenna modules and communication devices
US-2025158269-A1 · May 15, 2025 · US
Conformal power delivery structure for direct chip attach architectures
US-12288750-B2 · Apr 29, 2025 · US
Microelectronic assemblies including solder and non-solder interconnects
US-2025118698-A1 · Apr 10, 2025 · US
Antenna modules and communication devices
US-12255382-B2 · Mar 18, 2025 · US
Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures
US-12242290-B2 · Mar 4, 2025 · US
Radio frequency front-end structures
US-2025071885-A1 · Feb 27, 2025 · US
Magnetic core inductors in interposer
US-12224252-B2 · Feb 11, 2025 · US
Package embedded magnetic inductor structures and manufacturing techniques for 5-50 mhz smps operations
US-2025022814-A1 · Jan 16, 2025 · US
Radio frequency front-end structures
US-12200855-B2 · Jan 14, 2025 · US
High-throughput additively manufactured power delivery vias and traces
US-12170244-B2 · Dec 17, 2024 · US
Package embedded magnetic power transformers for SMPS
US-12154710-B2 · Nov 26, 2024 · US
Package embedded magnetic inductor structures and manufacturing techniques for 5-50 MHZ SMPS operations
US-12132015-B2 · Oct 29, 2024 · US
Multi-phase switching regulators with hybrid inductors and per phase frequency control
US-12068684-B2 · Aug 20, 2024 · US
Layer transfer clamp for gallium nitride (gan) integrated circuit technology
US-2024203978-A1 · Jun 20, 2024 · US
High performance integrated RF passives using dual lithography process
US-12002745-B2 · Jun 4, 2024 · US
Radio frequency front-end structures
US-2024164010-A1 · May 16, 2024 · US
Radio frequency front-end structures
US-11937367-B2 · Mar 19, 2024 · US
Antenna modules and communication devices
US-2024072419-A1 · Feb 29, 2024 · US
Package architecture with integrated capacitors in quasi-monolithic chip layers
US-2024063202-A1 · Feb 22, 2024 · US
Antenna package using ball attach array to connect antenna and base substrates
US-2024063544-A1 · Feb 22, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 106 |
| Chiu Chia-Pin | 1 |
| Ma Qing | 1 |
| Sankman Robert L | 1 |
| Fischer Paul B | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/685 | 56 |
| H10W90/00 | 56 |
| H10W90/724 | 55 |
| H10W70/65 | 51 |
| H10W90/701 | 39 |