Antenna modules and communication devices

Patent metadata

Field	Value
Publication number	US-12255382-B2
Application number	US-202318504376-A
Country	US
Kind code	B2
Filing date	Nov 8, 2023
Priority date	Mar 29, 2018
Publication date	Mar 18, 2025
Grant date	Mar 18, 2025

Abstract

Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

First claim

The invention claimed is:

1. An antenna module, comprising:
a plurality of antenna patches in a first plane defined in linear co-ordinates by a first axis and an orthogonal second axis; and
a radio frequency front-end (RFFE) die in a second plane parallel to the first plane and offset from the first plane along a third axis mutually orthogonal to the first axis and the second axis,
wherein:
the antenna patches are arranged in a linear array along the first axis with a center of each antenna patch along the first axis,
each antenna patch has an edge along a fourth axis in the first plane, and
there is a non-zero angle between the fourth axis and the first axis.

2. The antenna module of claim 1 , wherein the antenna patches are arranged in an antenna board.

3. The antenna module of claim 2 , wherein:
the RFFE die comprises RFFE circuitry,
the antenna module comprises another die including logic circuitry on the antenna board, and the logic circuitry is configured to control operations of the RFFE circuitry.

4. The antenna module of claim 3 , wherein:
the die including the logic circuitry is in an integrated circuit (IC) package,
the RFFE die is in the antenna board, and the
IC package is coupled to a face of the antenna board.

5. The antenna module of claim 1 , wherein any one antenna patch includes a plurality of antenna layers.

6. The antenna module of claim 1 , further comprising additional antenna patches in the linear array with zero angle between the fourth axis and the first axis.

7. The antenna module of claim 1 , wherein the antenna module is to support communication in a plurality of frequencies.

8. The antenna module of claim 1 , wherein a number of antenna patches is between four and eight.

9. An antenna module, comprising:
a radio frequency front-end (RFFE) die in a first plane defined in linear co-ordinates by a first axis and an orthogonal second axis; and
a plurality of antenna patches with the antenna patches arranged in a linear array in a second plane,
wherein:
the second plane is parallel to the first plane and offset from the first plane along a third axis mutually orthogonal to the first axis and the second axis,
respective centers of the antenna patches are along the first axis,
each antenna patch is rotated around the second axis with non-zero angles between respective planes of each antenna patch and the RFFE die.

10. The antenna module of claim 9 , further comprising an antenna patch fixture to maintain the antenna patches at the non-zero angles.

11. The antenna module of claim 9 , wherein each antenna patch is rotated around its center relative to the first axis.

12. The antenna module of claim 9 , wherein the antenna patches are arranged in an antenna board.

13. The antenna module of claim 12 , wherein:
the RFFE die comprises RFFE circuitry,
the antenna module comprises another die including logic circuitry on the antenna board, and the logic circuitry is configured to control operations of the RFFE circuitry.

14. The antenna module of claim 13 , wherein:
the die including the logic circuitry is in an integrated circuit (IC) package,
the RFFE die is in the antenna board, and the
IC package is coupled to a face of the antenna board.

15. The antenna module of claim 13 , wherein the antenna module is to support communication in a plurality of frequencies.

16. An antenna module, comprising:
a plurality of antenna patches arranged in a planar array in a first plane defined in linear co-ordinates by a first axis and an orthogonal second axis; and
a radio frequency front-end (RFFE) die in a second plane parallel to the first plane and offset from the first plane along a third axis mutually orthogonal to the first axis and the second axis.

17. The antenna module of claim 16 , wherein the RFFE die is smaller than any one of the antenna patches in the plurality of antenna patches.

18. The antenna module of claim 16 , wherein:
the planar array comprises a first subset and a second subset,
the antenna patches in the first subset are to support communication at a first frequency, and
the antenna patches in the second subset are to support communication at a second frequency.

19. The antenna module of claim 18 , further comprising a first integrated circuit (IC) package and a second IC package, wherein:
the first IC package is over the first subset,
the second IC package is over the second subset, and
the first IC package and the second IC package are in a third plane offset from the first plane along the third axis.

20. The antenna module of claim 16 , wherein at least one antenna patch is rotationally offset from adjacent antenna patches.

Assignees

• Intel Corp

Inventors

• Dalmia Sidharth
• Jensen Jonathan
• Inac Ozgur
• Thai Trang
• Lambert William J
• Jann Benjamin

Classifications

• H10W42/273

  the arrangements being between laterally adjacent chips, e.g. walls between chips · CPC title

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W44/248

  for antennas · CPC title

• H10W44/20

  at high-frequency [HF] or radio frequency [RF] · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title