Keep out zone with hydrophobic surface for integrated circuit (IC) package

Patent metadata

Field	Value
Publication number	US-12575415-B2
Application number	US-202016752457-A
Country	US
Kind code	B2
Filing date	Jan 24, 2020
Priority date	Jan 24, 2020
Publication date	Mar 10, 2026
Grant date	Mar 10, 2026

Abstract

Embodiments herein describe techniques for an IC package including a supporting layer having a first zone and a second zone. An electronic component is placed above the first zone of the supporting layer. An underfill material is formed above the first zone of the supporting layer, around or below the electronic component to support the electronic component. The second zone of the supporting layer includes a base area and multiple micro-pillars above the base area, where any two micro-pillars of the multiple micro-pillars are separated by a gap in between. The second zone has a hydrophobic surface including surfaces of the multiple micro-pillars and surfaces of the base area. The second zone is a keep out zone to prevent the underfill material from entering the second zone. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1 . An integrated circuit (IC) package, comprising:
a supporting layer comprising a first zone, a second zone, and a third zone, the first zone comprising a first portion adjacent to a first side of the second zone, and the first zone comprising a second portion adjacent to a second side of the second zone, the second side laterally opposite the first side, wherein the second zone is intervening between the first portion of the first zone and the second portion of the first zone; a first electronic component above the first portion of the first zone of the supporting layer, and a second electronic component above the second portion of the first zone of the supporting layer; and an underfill material above the first zone of the supporting layer, around or below the first electronic component and the second electronic component; wherein the second zone of the supporting layer comprises a base area and multiple micro-pillars above the base area, the micro-pillars comprising an uppermost surface at a same level as an uppermost surface of the first zone of the supporting layer, wherein two micro-pillars of the multiple micro-pillars are separated by a gap therebetween, and the second zone has a hydrophobic surface comprising surfaces of the multiple micro-pillars and surfaces of the base area, wherein the third zone comprises a hydrophobic surface, and wherein the third zone is a keep out zone in a shape of a diagonal line around an edge of at least one of the first electronic component or the second electronic component to prevent the underfill material from entering the third zone.

2 . The IC package of claim 1 , wherein the underfill material is completely kept out of the second zone.

3 . The IC package of claim 1 , wherein the supporting layer comprises one or more of a solder resist layer, a metal layer, a mold layer, a core layer, a dielectric layer, an insulated polymer layer, or a silicon substrate.

4 . The IC package of claim 1 , wherein the first zone of the supporting layer has a flat surface.

5 . The IC package of claim 1 , wherein the second zone is vertically next to an edge of the first electronic component.

6 . The IC package of claim 1 , wherein the gap between the two micro-pillars has a width in a range of about 10 micrometers (um) to about 100 um, and a micro-pillar of the multiple micro-pillars has a height in a range of about 1 um to about 20 um.

7 . The IC package of claim 1 , wherein:
a micro-pillar of the multiple micro-pillars is of a triangle shape, a half circle shape, a circular shape, an elliptical shape, a square, a rectangle shape, or a polygon comprising three or more sides; and the gap between the two micro-pillars is of a triangle shape, a half circle shape, a circular shape, an elliptical shape, a square, a rectangle shape, or a polygon comprising three or more sides.

8 . The IC package of claim 1 , wherein the IC package is one of a chip scale package (CSP), a wafer-level package (WLP), a stacked IC package, a system-in-package (SiP), a multi-chip package (WCP), a quad-flat no-leads (QFN) package, a dual-flat no-leads (DFN) package, a flip chip package, or a ball grid array (BGA) package.

9 . The IC package of claim 1 , wherein the first electronic component or the second electronic component comprises one or more of a capacitor, an mmWave antenna module, a central processing unit (CPU), a graphic processing unit (GPU), a memory chip, a phase-locked loop (PLL) chip, an input/output (I/O) interface chip, an application specific integrated circuit, a field-programmable gate array, a high-bandwidth memory, a package-embedded memory, a random access memory, a flash memory, an embedded nonvolatile memory, a graphics card, a group III-V die, an accelerator, a capacitor, a passive component, an inductor, or an active component.

10 . The IC package of claim 1 , wherein the underfill material comprises one or more of epoxy resin, acrylates, bismaleimides, polyesters, polyimides, polyolefins, polystyrene, polyurethanes, polyurethane resin, silicone resin, polyester resin, silica, alumina, boron nitride, zinc oxide, a filler material, colorants, inhibitors, ion trappers, stress absorbers, polymers, surfactants, binding agents, fluxing agents, or additives.

11 . The IC package of claim 1 , wherein the IC package further includes a layer of second material above the second zone, wherein the second material is different from the underfill material.

12 . The IC package of claim 11 , wherein the second material above the second zone includes a passive material, a lid, a metal stiffener, or an underfill for a different electronic component.

13 . The IC package of claim 1 , wherein the IC package further comprises a package substrate below the supporting layer, and wherein the package substrate comprises one or more of a polymeric substrate, a non-polymeric substrate, a silicon substrate, a silicon on insulator (SOI) substrate, or a silicon on sapphire (SOS) substrate.

14 . The IC package of claim 1 , further comprising another electronic component and another keep out zone, the another keep out zone being in a shape of an L around two edges of the another electronic component.

15 . A computing device, comprising:
a printed circuit board (PCB); and an integrated circuit (IC) package attached to the PCB, wherein the IC package comprises:
a supporting layer comprising a first zone, a second zone, and a third zone, the first zone comprising a first portion adjacent to a first side of the second zone, and the first zone comprising a second portion adjacent to a second side of the second zone, the second side laterally opposite the first side, wherein the second zone is intervening between the first portion of the first zone and the second portion of the first zone;
a layer of underfill material above the first zone of the supporting layer;
a first electronic component above the first portion of the first zone of the supporting layer, and a second electronic component above the second portion of the first zone of the supporting layer, wherein the layer of underfill material is around or below the first electronic component and the second electronic component; and
wherein the second zone of the supporting layer comprises a base area and multiple micro-pillars above the base area, the micro-pillars comprising an uppermost surface at a same level as an uppermost surface of the first zone of the supporting layer, wherein two micro-pillars of the multiple micro-pillars are separated by a gap therebetween, and the second zone has a hydrophobic surface comprising surfaces of the multiple micro-pillars and surfaces of the base area, wherein the third zone comprises a hydrophobic surface, and wherein the third zone is a keep out zone in a shape of a diagonal line around an edge of at least one of the first electronic component or the second electronic component to prevent the underfill material from entering the third zone.

16 . The computing device of claim 15 , wherein the underfill material comprises one or more of epoxy resin, acrylates, bismaleimides, polyesters, polyimides, polyolefins, polystyrene, polyurethanes, polyurethane resin, silicone resin, polyester resin, silica, alumina, boron nitride, zinc oxide, a filler material, colorants, inhibitors, ion trappers, stress absorbers, polymers, surfactants, binding agents, fluxing agents, or additives.

17 . The computing device of claim 15 , wherein the first electronic component or the second electronic component comprises one or more of a capacitor, an mmWave antenna mod

Assignees

• Sk Hynix Nand Product Solutions Corp

Inventors

• Ziadeh Bassam
• Van Nausdle Joseph
• Yang Zhou
• Lambert William J
• Modi Mitul

Classifications

• H10W95/00

  Packaging processes not covered by the other groups of this subclass · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title