Distributed semiconductor die and package architecture
US-10685947-B2 · Jun 16, 2020 · US
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Sankman Robert L patents
Sankman Robert L holds 11 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 11 |
| Recent patents | 0 |
| First publication | Aug 4, 2015 |
| Latest publication | Jun 16, 2020 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Method of making glass core substrate for integrated circuit devices
US-10070524-B2 · Sep 4, 2018 · US
Integration of laminate MEMS in BBUL coreless package
US-9708178-B2 · Jul 18, 2017 · US
3D integrated circuit package with through-mold first level interconnects
US-9530758-B2 · Dec 27, 2016 · US
Integration of embedded thin film capacitors in package substrates
US-9420693-B2 · Aug 16, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Distributed semiconductor die and package architecture
US-10685947-B2 · Jun 16, 2020 · US
Method of making glass core substrate for integrated circuit devices
US-10070524-B2 · Sep 4, 2018 · US
Integration of laminate MEMS in BBUL coreless package
US-9708178-B2 · Jul 18, 2017 · US
3D integrated circuit package with through-mold first level interconnects
US-9530758-B2 · Dec 27, 2016 · US
Integration of embedded thin film capacitors in package substrates
US-9420693-B2 · Aug 16, 2016 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W90/724 | 7 |
| H01L2924/00 | 7 |
| H10W72/241 | 6 |
| H10W74/15 | 6 |
| H10W72/9413 | 6 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 11 |
| Cross-Sectional Technologies | 1 |
| Operations & Transport | 1 |