Radio frequency front-end structures

Patent metadata

Field	Value
Publication number	US-12200855-B2
Application number	US-202418418513-A
Country	US
Kind code	B2
Filing date	Jan 22, 2024
Priority date	Feb 5, 2019
Publication date	Jan 14, 2025
Grant date	Jan 14, 2025

Abstract

Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

First claim

The invention claimed is:

1. A radio frequency (RF) communication assembly, comprising:
a package substrate comprising a first layer comprising first conductive interconnects and a circuit component, wherein the circuit component is one of a capacitor, an inductor, or a balun;
a processing device coupled to the package substrate;
an epoxy material over the processing device; and
a second layer comprising second conductive interconnects over the epoxy material, wherein one or more of the second conductive interconnects are conductively coupled to one or more of the first conductive interconnects.

2. The RF communication assembly of claim 1 , wherein the package substrate does not include a ground plane.

3. The RF communication assembly of claim 1 , wherein the second layer is conformal to the epoxy material.

4. The RF communication assembly of claim 1 , wherein the processing device includes one or more passive circuit elements.

5. The RF communication assembly of claim 1 , further comprising a circuit board coupled to the package substrate.

6. The RF communication assembly of claim 5 , wherein the second layer is conductively coupled to a ground of the circuit board.

7. The RF communication assembly of claim 5 , wherein the circuit board is coupled to the package substrate at least in part by a plurality of solder balls.

8. The RF communication assembly of claim 1 , wherein the circuit component includes at least one via.

9. The RF communication assembly of claim 1 , further comprising a harmonic filter or a matching filter.

10. The RF communication assembly of claim 1 , further comprising an antenna communicatively coupled to the package substrate.

11. The RF communication assembly of claim 1 , wherein the RF communication assembly is a handheld computing device, a tablet computing device, or a wearable computing device.

12. The RF communication assembly of claim 1 , wherein the RF communication assembly is a Wi-Fi communication assembly.

13. The RF communication assembly of claim 1 , wherein a footprint of the package substrate has an area that is less than 10 square millimeters.

14. A radio frequency (RF) communication assembly, comprising:
a package substrate comprising an element embedded therein, and further comprising a layer comprising conductive interconnects, wherein at least a portion of the element is in the layer, and wherein the element is one of a capacitor, an inductor, or a balun; and
a ground plane in the layer.

15. The RF communication assembly of claim 14 , wherein the package substrate further includes conductive contacts for second-level interconnects, and the layer is a metallization layer closest to the conductive contacts.

16. The RF communication assembly of claim 14 , further comprising:
a harmonic filter, wherein the harmonic filter includes the element, or
a matching filter, wherein the matching filter includes the element.

17. The RF communication assembly of claim 14 , further comprising an antenna communicatively coupled to the package substrate.

18. The RF communication assembly of claim 14 , wherein the RF communication assembly is a handheld computing device, a tablet computing device, or a wearable computing device.

19. A radio frequency (RF) communication assembly, comprising:
an RF package substrate comprising a metal layer and a capacitor, wherein the metal layer includes a first capacitor electrode of the capacitor; and
a circuit board coupled to the RF package substrate, wherein the circuit board includes a second capacitor electrode of the capacitor.

20. The RF communication assembly of claim 19 , wherein the RF package substrate further includes a ground plane.

Assignees

• Intel Corp

Inventors

• Dalmia Sidharth
• Jiang Zhenguo
• Lambert William J
• Nahalingam Kirthika
• Vijayakumar Swathi

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10W72/29

  Bond pads specially adapted therefor · CPC title

• H10W44/248

  for antennas · CPC title

• H10W44/234

  Arrangements for impedance matching · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title