Antenna package using ball attach array to connect antenna and base substrates

Patent metadata

Field	Value
Publication number	US-12586906-B2
Application number	US-202318498411-A
Country	US
Kind code	B2
Filing date	Oct 31, 2023
Priority date	Sep 29, 2017
Publication date	Mar 24, 2026
Grant date	Mar 24, 2026

Abstract

In accordance with disclosed embodiments, there is an antenna package using a ball attach array to connect an antenna and base substrates of the package. One example is an RF module package including an RF antenna package having a stack material in between a top and a bottom antenna layer to form multiple antenna plane surfaces, a base package having alternating patterned conductive and dielectric layers to form routing through the base package, and a bond between a bottom surface of the antenna package and to a top surface of the base package.

First claim

The invention claimed is:

1 . An electronic assembly, comprising:
an antenna package comprising multiple antenna plane surfaces, wherein the multiple antenna plane surfaces include a stack material in between a top and a bottom antenna layer; a base substrate comprising multiple horizontal layers comprising a dielectric material, wherein individual horizontal layers include layers of patterned conductive material; and a bond between a bottom surface of the antenna package and a top surface of the base substrate.

2 . The electronic assembly of claim 1 , wherein the bond comprises a ball grid array between the antenna package and the base substrate.

3 . The electronic assembly of claim 2 , wherein the ball grid array comprises an array of solder balls on the top surface of the base substrate and an underfill between the solder balls.

4 . The electronic assembly of claim 3 , further comprising a patterned solder stop layer on the bottom surface of the antenna package and on the top surface of the base substrate between the solder balls.

5 . The electronic assembly of claim 2 , wherein the ball grid array includes an array of solder balls, and wherein the solder balls include copper.

6 . The electronic assembly of claim 1 , wherein the dielectric material is a first dielectric material, and the stack material is a second dielectric material.

7 . The electronic assembly of claim 1 , wherein the antenna plane surfaces form a millimeter wave antenna.

8 . The electronic assembly of claim 1 , wherein the electronic assembly is a radio frequency (RF) module.

9 . The electronic assembly of claim 1 , further comprising a communication chip coupled to the antenna package.

10 . The electronic assembly of claim 9 , further comprising a system board and a processor, wherein the processor is coupled to the system board and the communication chip is coupled to the system board.

11 . A communication device, comprising:
an electronic assembly; and a circuit board coupled to the electronic assembly, wherein the electronic assembly includes:
a radio frequency (RF) antenna package comprising antenna patches in multiple antenna layers, and further comprising a first dielectric material separating an antenna patch in a top antenna layer of the multiple antenna layers and an antenna patch in a bottom antenna layer of the multiple antenna layers,
package substrate comprising:
a second dielectric material,
a plurality of layers extending through the second dielectric material and being parallel to the antenna patches, wherein the plurality of layers include conductive traces embedded in the second dielectric material, and
conductive vias extending in a direction perpendicular to the antenna patches between two or more layers of the plurality of layers, and

a bond between a bottom surface of the RF antenna package and a top surface of the package substrate.

12 . The communication device of claim 11 , further comprising:
a housing, wherein the electronic assembly and the circuit board are in the housing; and cameras in the housing.

13 . The communication device of claim 11 , wherein a footprint of the antenna patch in the top antenna layer of the multiple antenna layers at least partially overlaps with a footprint of the antenna patch in the bottom antenna layer of the multiple antenna layers.

14 . The communication device of claim 11 , wherein the antenna patch in the top antenna layer of the multiple antenna layers is stacked above the antenna patch in the bottom antenna layer of the multiple antenna layers.

15 . A method of fabricating an electronic assembly, the method comprising:
providing an antenna package comprising antenna patches in a plurality of antenna layers and a first dielectric material between a top antenna layer of the plurality of antenna layers and a bottom antenna layer of the plurality of antenna layers; providing a base substrate comprising horizontal layers of a second dielectric material, wherein two or more of the horizontal layers include sub-layers comprising conductive material; and providing a bond between a surface of the antenna package and a surface of the base substrate.

16 . The method of claim 15 , wherein the bond includes a ball grid array between the antenna package and the base substrate.

17 . The method of claim 16 , wherein the ball grid array includes an array of solder balls on the top surface of the base substrate and an underfill between the solder balls.

18 . The method of claim 17 , further comprising:
providing a patterned solder stop layer on the surface of the antenna package and on the surface of the base substrate between the solder balls.

19 . The method of claim 16 , wherein the ball grid array includes an array of solder balls, and wherein the solder balls include copper.

20 . The method of claim 15 , wherein the electronic assembly is a radio frequency (RF) module.

Assignees

• Intel Corp

Inventors

• Yao Jimin
• Sankman Robert L
• Liff Shawna M
• Chavali Sri Chaitra Jyotsna
• Lambert William J
• Zhang Zhichao

Classifications

• H10W44/248

  for antennas · CPC title

• H10W44/209

  Vertical interconnections, e.g. vias · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/012

  of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills · CPC title