Techniques for processing devices
US-2026068765-A1 · Mar 5, 2026 · US
This page is not indexed by search engines while we improve data quality.
Gao Guilian patents
Gao Guilian is listed as an inventor on 231 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Gao Guilian |
| Total patents | 231 |
| First publication | Sep 10, 2015 |
| Latest publication | Mar 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Processing stacked substrates
US-2026068566-A1 · Mar 5, 2026 · US
Metal pads over tsv
US-2026060053-A1 · Feb 26, 2026 · US
Structures with through-substrate vias and methods for forming the same
US-2026047415-A1 · Feb 12, 2026 · US
Debondable test wafer/probe card
US-2026043830-A1 · Feb 12, 2026 · US
Structures and methods for bonding dies
US-2026047472-A1 · Feb 12, 2026 · US
Direct bonding and debonding of carrier
US-12525572-B2 · Jan 13, 2026 · US
Composite hybrid structures
US-2025391794-A1 · Dec 25, 2025 · US
Mitigating surface damage of probe pads in preparation for direct bonding of a substrate
US-2025385141-A1 · Dec 18, 2025 · US
Dimension compensation control for directly bonded structures
US-2025372573-A1 · Dec 4, 2025 · US
Recent patents
Latest publications not already listed above.
Post cmp processing for hybrid bonding
US-2025364481-A1 · Nov 27, 2025 · US
Metal pads over TSV
US-12482776-B2 · Nov 25, 2025 · US
Seal for microelectronic assembly
US-2025343086-A1 · Nov 6, 2025 · US
DBI to Si bonding for simplified handle wafer
US-12438122-B2 · Oct 7, 2025 · US
Methods and apparatuses for removing temporary bonding material
US-2025308927-A1 · Oct 2, 2025 · US
Offset pads over tsv
US-2025300135-A1 · Sep 25, 2025 · US
Mitigating surface damage of probe pads in preparation for direct bonding of a substrate
US-12417950-B2 · Sep 16, 2025 · US
Post CMP processing for hybrid bonding
US-12406959-B2 · Sep 2, 2025 · US
Techniques for processing devices
US-12406975-B2 · Sep 2, 2025 · US
Embedded cooling systems for advanced device packaging
US-2025273538-A1 · Aug 28, 2025 · US
Direct bonded stack structures for increased reliability and improved yield in microelectronics
US-2025266401-A1 · Aug 21, 2025 · US
Tsv as pad
US-2025253294-A1 · Aug 7, 2025 · US
Structures with through-substrate vias and methods for forming the same
US-12381128-B2 · Aug 5, 2025 · US
Seal for microelectronic assembly
US-12381119-B2 · Aug 5, 2025 · US
Molded direct bonded and interconnected stack
US-2025246583-A1 · Jul 31, 2025 · US
Processing stacked substrates
US-12374556-B2 · Jul 29, 2025 · US
Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
US-2025231341-A1 · Jul 17, 2025 · US
Embedded cooling systems and methods of manufacturing embedded cooling systems
US-2025226290-A1 · Jul 10, 2025 · US
Display devices using reconstituted substrates and methods of forming the same
US-2025221128-A1 · Jul 3, 2025 · US
Transfer of multiple small elements to a carrier
US-2025212554-A1 · Jun 26, 2025 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Adeia Semiconductor Bonding Technologies Inc | 98 |
| Invensas Corp | 66 |
| Invensas Bonding Tech Inc | 66 |
| Adeia Semiconductor Tech Llc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 152 |
| H10W80/327 | 122 |
| H10W90/792 | 120 |
| H10W72/0198 | 117 |
| H10W80/312 | 113 |