Transfer of multiple small elements to a carrier

Patent metadata

Field	Value
Publication number	US-2025212554-A1
Application number	US-202418745374-A
Country	US
Kind code	A1
Filing date	Jun 17, 2024
Priority date	Dec 22, 2023
Publication date	Jun 26, 2025
Grant date	—

Abstract

A method of transferring a plurality of individual elements including providing a plurality of singulated elements on a stretchable tape, stretching the stretchable tape to increase separation between the singulated elements and forming a reconstituted wafer with at least one of the plurality of elements.

First claim

1 . A method of transferring a plurality of singulated elements comprising:
providing a plurality of singulated elements on a stretchable tape; stretching the stretchable tape to increase separation between the singulated elements; and forming a reconstituted wafer with at least one of the plurality of elements.

2 . The method of claim 1 , wherein forming a reconstituted wafer comprises testing the singulated elements and only using known good elements.

3 . The method of claim 1 , wherein dicing comprises plasma etching, laser ablation or sawing.

4 . The method of claim 1 , wherein the stretchable tape is stretched at least 50% relative to an unstretched area of the stretchable tape.

5 . The method of claim 1 , wherein the reconstituted wafer is formed on the stretchable tape.

6 . (canceled)

7 . (canceled)

8 . (canceled)

9 . The method of claim 1 , wherein the reconstituted wafer is formed on a second carrier, different from the stretchable tape.

10 . (canceled)

11 . (canceled)

12 . The method of claim 1 , wherein the at least first semiconductor wafer comprises a semiconductor material with a band gap suitable for light emitting diodes (LED).

13 . (canceled)

14 . (canceled)

15 . (canceled)

16 . The method of claim 1 , wherein stretching the stretchable tape comprises unfolding pre-folded portions of the stretchable tape.

17 . The method of claim 1 , wherein stretching the stretchable tape comprises forming a patterned stretchable tape.

18 . The method of claim 1 , further comprises periodically processing the stretchable tape to allow increased stretching.

19 . (canceled)

20 . The method of claim 1 , further comprising:
affixing at least a second semiconductor wafer to a second stretchable tape; dicing the at least second semiconductor wafer to form a plurality of second singulated elements; and forming a reconstituted wafer with at least a portion of the first plurality of singulated elements and plurality of second singulated elements, wherein the first at least semiconductor wafer comprises a semiconductor material with a band gap suitable for short wavelength infrared sensors (SWIR) or a semiconductor material with a band gap suitable for light emitting diodes and wherein the reconstituted wafer is formed on a third carrier, different from the first stretchable tape and the second tape frame.

21 . (canceled)

22 . (canceled)

23 . The method of claim 1 , wherein providing a plurality of individual elements singulated elements on a stretchable tape comprises:
affixing at least a first semiconductor wafer to a stretchable tape; and dicing the at least first semiconductor wafer to form a plurality of individual elements.

24 . The method of claim 1 , wherein forming a reconstituted wafer comprises at least partially embedding the plurality of individual elements in an encapsulant.

25 . (canceled)

26 . (canceled)

27 . The method of claim 1 , wherein forming a reconstituted wafer comprises simultaneously transferring multiple elements of the plurality of singulated elements to a carrier wafer.

28 . (canceled)

29 . A method of transferring a plurality of singulated elements comprising:
providing a plurality of singulated elements on a stretchable tape comprising an array of adhesive pillars; stretching the stretchable tape to increase separation between the singulated elements; and forming a reconstituted wafer with at least a portion of the plurality of singulated elements.

30 . The method of claim 29 , further comprising:
depositing an adhesive layer on a stretchable tape; and patterning the adhesive layer to form an array of adhesive pillars on the stretchable tape.

31 . (canceled)

32 . (canceled)

33 . (canceled)

34 . (canceled)

35 . stretching a stretchable tape having singulated integrated device elements thereon to increase a separation distance between adjacent singulated integrated device elements; and
providing an encapsulant over a carrier to which the singulated integrated device elements are affixed and at least partially embedding the singulated integrated device elements in the encapsulant.

36 . The method of claim 35 , wherein the carrier is the stretchable tape or a separate carrier.

37 . The method of claim 35 , further comprising forming a bonding layer comprising bond pads and field regions between the bond pads.

38 . (canceled)

39 . The method of claim 35 , further comprising simultaneously transferring multiple elements of the plurality of singulated elements to a carrier.

40 . (canceled)

Assignees

• Adeia Semiconductor Bonding Technologies Inc

Inventors

• Katkar Rajesh
• Haba Belgacem
• Uzoh Cyprian Emeka
• Gao Guilian
• Workman Thomas

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/018

  Bonding of wafers · CPC title

• H10H20/0362

  of encapsulations · CPC title

• H10H20/0364

  of interconnections · CPC title

• H10H20/01 Primary

  Manufacture or treatment · CPC title