Method of forming conductive member and method of forming channel
US-12598926-B2 · Apr 7, 2026 · US
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Akiyama Koji patents
Akiyama Koji is listed as an inventor on 38 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Akiyama Koji |
| Total patents | 38 |
| First publication | Jan 15, 2015 |
| Latest publication | Apr 7, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Film formation method
US-12538504-B2 · Jan 27, 2026 · US
Substrate processing method and substrate processing system
US-2025347002-A1 · Nov 13, 2025 · US
Metal-containing film and method for producing metal-containing film
US-2025305147-A1 · Oct 2, 2025 · US
Vacuum processing apparatus and oxidizing gas removal method
US-12406862-B2 · Sep 2, 2025 · US
Method of manufacturing semiconductor device and semiconductor device
US-2025248057-A1 · Jul 31, 2025 · US
Manufacturing method for semiconductor device
US-12349434-B2 · Jul 1, 2025 · US
Substrate processing apparatus
US-2025174439-A1 · May 29, 2025 · US
Electrocaloric effect element, heat transfer device, semiconductor manufacturing device, and electrocaloric effect element control method
US-12247768-B2 · Mar 11, 2025 · US
Liquid circulation system, substrate processing apparatus, and liquid circulation method
US-2024420970-A1 · Dec 19, 2024 · US
Recent patents
Latest publications not already listed above.
Substrate processing method and substrate processing apparatus
US-2024304439-A1 · Sep 12, 2024 · US
Semiconductor device manufacturing method and semiconductor device
US-2024155824-A1 · May 9, 2024 · US
Vacuum processing apparatus and oxidizing gas removal method
US-2024087916-A1 · Mar 14, 2024 · US
Film formation method
US-2023361163-A1 · Nov 9, 2023 · US
Manufacturing method for semiconductor device
US-2023326977-A1 · Oct 12, 2023 · US
Method of manufacturing semiconductor device, semiconductor manufacturing device, and system
US-2023223251-A1 · Jul 13, 2023 · US
Electrocaloric effect element, heat transfer device, semiconductor manufacturing device, and electrocaloric effect element control method
US-2023135523-A1 · May 4, 2023 · US
Purification processing apparatus, substrate processing system, and processing method
US-2023111710-A1 · Apr 13, 2023 · US
Method of forming conductive member and method of forming channel
US-2023086545-A1 · Mar 23, 2023 · US
Vacuum processing apparatus and oxidizing gas removal method
US-2022403509-A1 · Dec 22, 2022 · US
Inputting data to a web page
US-11222169-B2 · Jan 11, 2022 · US
Semiconductor device
US-11211288-B2 · Dec 28, 2021 · US
Selective film forming method and method of manufacturing semiconductor device
US-10490443-B2 · Nov 26, 2019 · US
Semiconductor device and cmos transistor
US-2019123165-A1 · Apr 25, 2019 · US
Selective Film Forming Method and Method of Manufacturing Semiconductor Device
US-2019096750-A1 · Mar 28, 2019 · US
Semiconductor Device
US-2019074216-A1 · Mar 7, 2019 · US
Inputting data to a web page
US-2019034398-A1 · Jan 31, 2019 · US
Method of controlling threshold of transistor and method of manufacturing semiconductor device
US-10153169-B2 · Dec 11, 2018 · US
Inputting data to a web page
US-10095675-B2 · Oct 9, 2018 · US
Method for producing metal and method for producing refractory metal
US-10072346-B2 · Sep 11, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tokyo Electron Ltd | 30 |
| IBM | 3 |
| Hitachi Ltd | 2 |
| Akiyama Koji | 2 |
| Toho Titanium Co Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/69392 | 7 |
| H10P95/00 | 7 |
| H10P14/69395 | 7 |
| H10D64/691 | 6 |
| H10D84/038 | 6 |