Substrate correction device, substrate lamination device, substrate processing system, substrate correction method, substrate processing method, and semiconductor device manufacturing method
US-2024404859-A1 · Dec 5, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P95/00 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 7,084 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 815 |
| 2016 | 779 |
| 2017 | 782 |
| 2018 | 699 |
| 2019 | 758 |
| 2020 | 653 |
| 2021 | 562 |
| 2022 | 510 |
| 2023 | 450 |
| 2024 | 498 |
| 2025 | 456 |
| 2026 | 122 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Bonded wafer and method for producing bonded wafer
US-2024379899-A1 · Nov 14, 2024 · US
Manufacturing method of display substrate, display substrate and display device
US-12062711-B2 · Aug 13, 2024 · US
Surface Treatment Compositions and Methods
US-2024258111-A1 · Aug 1, 2024 · US
Method for manufacturing electronic device
US-2024258152-A1 · Aug 1, 2024 · US
Carrier tape
US-2024239581-A1 · Jul 18, 2024 · US
Laminate, release agent composition, and method for manufacturing processed semiconductor substrate
US-2024208179-A1 · Jun 27, 2024 · US
Treatment methods for silicon nanosheet surfaces
US-2024055265-A1 · Feb 15, 2024 · US
Low profile wire bonded USB device
US-9218953-B2 · Dec 22, 2015 · US
Fluid control device
US-9212755-B2 · Dec 15, 2015 · US
Method providing an epitaxial photonic device having a reduction in defects and resulting structure
US-9184191-B2 · Nov 10, 2015 · US
High linearity SOI wafer for low-distortion circuit applications
US-9165819-B2 · Oct 20, 2015 · US
Proportional and uniform controlled gas flow delivery for dry plasma etch apparatus
US-9162236-B2 · Oct 20, 2015 · US
Contactor and semiconductor test apparatus comprising the same
US-9164127-B2 · Oct 20, 2015 · US
Apparatus and method for measuring thickness and temperature and substrate processing system
US-9163931-B2 · Oct 20, 2015 · US
Lithography using multilayer spacer for reduced spacer footing
US-9159579-B2 · Oct 13, 2015 · US
Packaging to reduce stress on microelectromechanical systems
US-9156673-B2 · Oct 13, 2015 · US
System and method for through silicon via yield
US-9153506-B2 · Oct 6, 2015 · US
Interconnect structure and fabrication method
US-9153480-B2 · Oct 6, 2015 · US
Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording medium
US-2015279682-A1 · Oct 1, 2015 · US
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P95/00?
- CPC H10P95/00 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H10P95/00 (Electricity)?
- Our database includes 7,084 publications tagged with this CPC code.
- Is patent activity under CPC H10P95/00 growing?
- Publication counts under this code: 498 in 2024 vs 456 in 2025 (latest complete years).