Electronic package and method of forming the same
US-2025246514-A1 · Jul 31, 2025 · US
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Yen You-Lung patents
Yen You-Lung is listed as an inventor on 84 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yen You-Lung |
| Total patents | 84 |
| First publication | Dec 3, 2015 |
| Latest publication | Jul 31, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Electronic package and method of forming the same
US-12283537-B2 · Apr 22, 2025 · US
Electronic device
US-2025029951-A1 · Jan 23, 2025 · US
Electronic package including a protection layer
US-12198999-B2 · Jan 14, 2025 · US
Semiconductor package structure
US-2024355793-A1 · Oct 24, 2024 · US
Semiconductor package structure and method for manufacturing the same
US-12009317-B2 · Jun 11, 2024 · US
Electronic carrier and method of manufacturing the same
US-12002743-B2 · Jun 4, 2024 · US
Electronic package and method of manufacturing the same
US-12002729-B2 · Jun 4, 2024 · US
Electronic package, semiconductor package structure, and method for manufacturing the semiconductor package structure
US-11961831-B2 · Apr 16, 2024 · US
Semiconductor package structure having substrate with embedded electronic component and conductive pillars
US-11881448-B2 · Jan 23, 2024 · US
Recent patents
Latest publications not already listed above.
Semiconductor device package
US-11830798-B2 · Nov 28, 2023 · US
Semiconductor device package, antenna device, and method for manufacturing the same
US-11830799-B2 · Nov 28, 2023 · US
Package substrate and method for manufacturing the same
US-11791281-B2 · Oct 17, 2023 · US
Electronic package and method for manufacturing the same
US-11791245-B2 · Oct 17, 2023 · US
Substrate structure, package structure and method for manufacturing electronic package structure
US-11735433-B2 · Aug 22, 2023 · US
Semiconductor package structure and method for manufacturing the same
US-11705401-B2 · Jul 18, 2023 · US
Semiconductor device package and method for manufacturing the same
US-11682656-B2 · Jun 20, 2023 · US
Semiconductor device package
US-11664301-B2 · May 30, 2023 · US
Package structure and method for manufacturing the same
US-11664339-B2 · May 30, 2023 · US
Substrate structure, semiconductor package structure and method for manufacturing semiconductor package structure
US-11631633-B2 · Apr 18, 2023 · US
Electronic package
US-2023097299-A1 · Mar 30, 2023 · US
Electronic package
US-11616007-B2 · Mar 28, 2023 · US
Leadframe including conductive pillar over land of conductive layer
US-11610834-B2 · Mar 21, 2023 · US
Electronic package, semiconductor package structure, and method for manufacturing the semiconductor package structure
US-2023058358-A1 · Feb 23, 2023 · US
Electronic carrier and method of manufacturing the same
US-2023046889-A1 · Feb 16, 2023 · US
Electronic package and method of forming the same
US-2023042800-A1 · Feb 9, 2023 · US
Electronic package and method for manufacturing the same
US-2023039430-A1 · Feb 9, 2023 · US
Semiconductor package
US-11574856-B2 · Feb 7, 2023 · US
Electronic package and method of manufacturing the same
US-2023037201-A1 · Feb 2, 2023 · US
Substrate structure, semiconductor package structure and method for manufacturing a substrate structure
US-11545406-B2 · Jan 3, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Advanced Semiconductor Eng | 84 |
| Phoenix Pioneer Technology Co Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 62 |
| H10W90/701 | 55 |
| H10W70/65 | 52 |
| H10W70/685 | 48 |
| H10W74/117 | 45 |