Electronic package and method of forming the same

Patent metadata

Field	Value
Publication number	US-12283537-B2
Application number	US-202117396604-A
Country	US
Kind code	B2
Filing date	Aug 6, 2021
Priority date	Aug 6, 2021
Publication date	Apr 22, 2025
Grant date	Apr 22, 2025

Abstract

An electronic package is provided in the present disclosure. The electronic package comprises: a heat spreading component; a first electronic component disposed on the heat spreading component; and a second electronic component disposed on the first electronic component, wherein the second electronic component comprises an interconnection structure passing through the second electronic component and electrically connecting the first electronic component. In this way, through the use of the interconnection structure, the heat dissipation of the electronic components in the package can be improved. Also, through the use of the encapsulant, the stacked electronic components can be protected by the encapsulant so as to avoid being damaged.

First claim

What is claimed is:

1. An electronic package, comprising:
a heat spreading component;
a first electronic component disposed under the heat spreading component;
a second electronic component disposed under the heat spreading component, and
an encapsulant disposed under the heat spreading component and encapsulating the first electronic component and the second electronic component,
wherein, in a cross-sectional view, a width of the first electronic component is greater than a width of the second electronic component, and the first electronic component is closer to the heat spreading component than the second electronic component is;
wherein a first pillar is disposed on a bottom surface of the first electronic component, the bottom surface of the first electronic component facing away from the heat spreading component, wherein the first pillar is encapsulated by the encapsulant and is exposed at a bottom surface of the encapsulant, the bottom surface of the encapsulant facing away from the heat spreading component;
wherein a first bump is disposed on the bottom surface of the first electronic component, and wherein the first bump is connected to the second electronic component;
wherein the first pillar and the first bump are overlapped with each other in a direction substantially parallel to a bottom surface of the heat spreading component, the bottom surface of the heat spreading component facing the encapsulant.

2. The electronic package of claim 1 , further comprising:
a third electronic component disposed under the heat spreading component and encapsulated by the encapsulant, wherein, in the cross-sectional view, the width of the second electronic component is greater than a width of the third electronic component, and the second electronic component is closer to the heat spreading component than the third electronic component is;
a second pillar is disposed on a bottom surface of the second electronic component, the bottom surface of the second electronic component facing away from the first electronic component, wherein the second pillar is encapsulated by the encapsulant and is exposed at the bottom surface of the encapsulant;
a second bump is disposed on the bottom surface of the second electronic component, and wherein the second bump is connected to the third electronic component;
wherein the second pillar and the second bump are overlapped with each other in the direction substantially parallel to the bottom surface of the heat spreading component.

3. The electronic package of claim 2 , further comprising a third pillar disposed on the bottom surface of the first electronic component, wherein the third pillar is encapsulated by the encapsulant and is exposed at the bottom surface of the encapsulant, and wherein the second pillar and the third pillar are positioned adjacent to each other, and wherein, in the cross-sectional view, a distance between the second pillar and the third pillar is greater than a pitch of the first pillar and the third pillar in the direction substantially parallel to the bottom surface of the heat spreading component.

4. The electronic package of claim 3 , wherein the second electronic component comprises an interconnection that passes through the second electronic component, and wherein the first pillar overlaps the interconnection of the second electronic component in the direction substantially parallel to the bottom surface of the heat spreading component.

5. The electronic package of claim 1 , further comprising a redistribution structure connected to the first pillar, wherein the redistribution structure comprises a via tapered toward the first pillar.

6. The electronic package of claim 5 , further comprising:
a third pillar disposed on the bottom surface of the first electronic component and configured to transmit heat from the first electronic component to the redistribution structure, wherein the third pillar is encapsulated by the encapsulant and is exposed at the bottom surface of the encapsulant;
a second pillar disposed on a bottom surface of the second electronic component, the bottom surface of the second electronic component facing away from the first electronic component, and the second pillar is configured to transmit heat from the second electronic component to the redistribution structure, and wherein the second pillar is encapsulated by the encapsulant and is exposed at the bottom surface of the encapsulant;
a fourth pillar disposed on the bottom surface of the second electronic component and configured to transmit heat from the second electronic component to the redistribution structure, wherein the fourth pillar is encapsulated by the encapsulant and is exposed at the bottom surface of the encapsulant;
a first solder under the redistribution structure, wherein the first solder overlaps the first pillar and the third pillar in a direction substantially perpendicular to the bottom surface of the heat spreading component;
a second solder under the redistribution structure, wherein the second solder overlaps the second pillar and the fourth pillar in the direction substantially perpendicular to the bottom surface of the heat spreading component.

7. The electronic package of claim 6 , further comprising a fifth pillar disposed on a bottom surface of the third electronic component, the bottom surface of the third electronic component facing away from the second electronic component, and the fifth pillar is configured to transmit heat from the third electronic component to the redistribution structure, and wherein the fifth pillar is encapsulated by the encapsulant and is exposed at the bottom surface of the encapsulant; wherein the redistribution structure comprises a first trace and a second trace exposed at a top surface of the redistribution structure, the top surface of the redistribution structure facing the heat spreading component, wherein the third pillar and the second pillar are in contact with the first trace, and wherein the fourth pillar and the fifth pillar are in contact with the second trace.

8. The electronic package of claim 4 , wherein the third electronic component comprises an interconnection that passes through the third electronic component, and wherein the second pillar overlaps the interconnection of the third electronic component in the direction substantially parallel to the bottom surface of the heat spreading component.

9. The electronic package of claim 8 , wherein the interconnection of the second electronic component is configured to transmit heat from the second electronic component toward the heat spreading component, and the interconnection of the third electronic component is configured to transmit heat from the third electronic component toward the heat spreading component.

10. The electronic package of claim 9 , further comprising a redistribution structure, which is connected to the first electronic component through the first pillar and connected to the second electronic component through the second pillar and connected to the third electronic component through an fifth pillar, wherein the fifth pillar is disposed on a bottom surface of the third electronic component, the bottom surface of the third electronic component facing away from the second electronic component, and wherein the fifth pillar is encapsulated by the encapsulant and is exposed at the bottom surface of the encapsulant, and wherein the first pillar is configured to transmit heat from the first electronic component to the redistribution structure, wherein the second pillar is configured to transmit heat from the second electronic component to the redistribution structure, and wherein the fifth pillar is configured to transmit heat from the third electronic

Assignees

• Advanced Semiconductor Eng

Inventors

• Yen You-Lung
• Appelt Bernd Karl

Classifications

• H10W90/297

  characterised by the through-semiconductor vias [TSVs] in the stacked chips · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/28

  the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape · CPC title

• H10W72/823

  Interconnections through encapsulations, e.g. pillars through molded resin on a lateral side a chip · CPC title